Thin film deposition on a corrugated surface: A molecular dynamics approach

被引:4
|
作者
Chen, Bin-Hao
Chen, Cha'o-Kuang
Chang, Shing Cheng [1 ]
机构
[1] Natl Cheng Kung Univ, Dept Mech Engn, Tainan 70101, Taiwan
[2] Ind Technol Res Inst, Energy & Environm Labs, Hsinchu 310, Taiwan
关键词
molecular dynamics; sputtering; thin film;
D O I
10.1016/j.nimb.2007.03.105
中图分类号
TH7 [仪器、仪表];
学科分类号
0804 ; 080401 ; 081102 ;
摘要
This paper presents the use of molecular dynamics (MD) simulation in the investigation of the surface topography of early-stage film growth on a GMR (giant-magnetoresistance) corrugated structure. The size of the simulated system is limited in order to reduce the computational workload. The numerical model adopts the Morse potential and the Verlet-leapfrog time evolution scheme [R.W. Hockney, 1970; D. Potter, 1972 (Chapter 5). [1]] to describe the atomic interactions which take place between the atoms. The impact energy transferred from the incident atoms to the substrate is modeled by rescaling the atoms within the upper substrate layers. It is found that the important properties of the film-substrate system may be obtained after the deposition of just several atomic layers. The influence of the impact velocity upon the coating parameters is investigated by varying the incident energy of the deposited atoms. The current results indicate that the surface coverage is poor, when atoms are deposited at low incident energies upon a low temperature substrate. At a higher incident energy, the deposited film tends to exhibit a quasi-layer-by-layer growth mechanism, which results in an improved surface coverage. Finally, it is demonstrated that a distinct quasi-fluid behavior is evident on the substrate when the atoms are deposited at high incident energies. (C) 2007 Elsevier B.V. All rights reserved.
引用
收藏
页码:517 / 524
页数:8
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