A NEW CHELATING SORBENT FOR REMOVAL OF COPPER (II) IN COROSSION MECHANISM AND POLLUTANT IONS

Copper and its alloys are part of common used metals in the microelectronic industry. Copper uses, in microelectronic industry include interconnection and electronic packaging. The presence of copper in different alloys creates galvanic cells, which causes rising in corrosion rates. This rising leads to failure of microelectronic devices. The ability of controlling the amount of copper ions Cu (II) bath system has been carried out. The sorption of Cu (II) ions depends on pH, being maximum (73%) at pH=5 and ph=10. In solution of pH 5, the Cu (II) sorption capacity increases with the increase of copper initial concentration, leading to the conclusion that the chelating ion exchanger under study could be used in processes of Cu (II) separation and preconcentration. The Cu (II) ions equilibrium distribution between solution phase and sorbent phase has been described by means Langmuir isotherm model. The calculated value of Gibbs free energy (Delta G=-13.975 KJmol), confirms the affinity of the ion exchange resin with hydroxamic acid and amidoxime groups towards Cu (II) ions. The type of corrosion mechanism and its rate of attach depend on the exact nature of the environment (air, soil, water) in wich the corrosion takes place.