Fracture mechanics analysis of low cost solder bumped flip chip assemblies with imperfect underfills

被引：15
|
作者：
Lau, JH [1 ]
Lee, SWR [1 ]
机构：
[1] Express Packaging Syst Inc, Palo Alto, CA 94303 USA
来源：
JOURNAL OF ELECTRONIC PACKAGING | 2000年 / 122卷 / 04期
关键词：
D O I：
10.1115/1.1289998
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
Solder joint reliability of flip chip on various thickness of printed circuit board with imperfect underfill is presented in this study. Emphasis is placed on the determination of the temperature-dependent stress and plastic strain at the corner solder joint with different crack (delamination) lengths. Also, the strain energy release rate and phase angle at the crack tip of the interface between the underfill and solder mask are obtained by fracture mechanics.
引用
收藏
页码：306 / 310
页数：5
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