Research on adhesive layer depth and frequency in weak interface of bonded structures

被引:3
|
作者
Qiu Zhaoguo [1 ]
Wu Bin [1 ]
He Cunfu [1 ]
机构
[1] Beijing Univ Technol, Coll Mech Engn & Appl Elect Technol, Beijing 100124, Peoples R China
关键词
D O I
10.1784/insi.2011.53.6.302
中图分类号
TH7 [仪器、仪表];
学科分类号
0804 ; 080401 ; 081102 ;
摘要
Ultrasound is reflected from a bonded layer between two solid bodies. The reflection coefficient depends on the resonance frequency, the acoustic properties of different solids, the layer depth and the interface stiffness. In this paper, the parameters of the bonded structures are studied for evaluating the weak interface of the bonded structures and a numerical calculation is carried out. According to the relationship between the ultrasonic propagation characteristics and the reflection echo, the reflection coefficient of the bonding layer is derived by a single reflection and a multiple reflection approach. The numerical results show that the bonded interface can be evaluated using the depth of the adhesive layer, resonance frequency and the stiffness ratio.
引用
收藏
页码:302 / 306
页数:5
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