Two-dimensional interstitial diffusion in silicon monitored by scanning capacitance microscopy

被引:3
|
作者
Giannazzo, F
Mirabella, S
Raineri, V
De Salvador, D
Napolitani, E
Terrasi, A
Carnera, A
Drigo, AV
Priolo, F
机构
[1] CNR IMM, Sez Catania, I-95121 Catania, Italy
[2] Univ Catania, INFM, I-95125 Catania, Italy
[3] Univ Catania, Dept Phys, I-95125 Catania, Italy
[4] Univ Padua, INFM, I-35131 Padua, Italy
[5] Univ Padua, Dipartimento Fis, I-35131 Padua, Italy
来源
MATERIALS SCIENCE AND ENGINEERING B-SOLID STATE MATERIALS FOR ADVANCED TECHNOLOGY | 2003年 / 102卷 / 1-3期
关键词
scanning capacitance microscopy; Si self-interstitials; diffusion;
D O I
10.1016/S0921-5107(03)00022-9
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
Scanning capacitance microscopy (SCM) has been applied to monitor the two-dimensional (2D) diffusion of Si self-interstitials (I). A sub-micron laterally confined source has been generated by Si self-implantation through a sub-micron oxide mask. The structure was grown by molecular beam epitaxy on (0 0 1) Si, with three spikes of B at different depths used as markers for the interstitial concentration. The measured 2D SCM maps have been accurately quantified to 2D carrier concentration profiles, yielding quantitative information on the B diffusion induced by the I flux. The I supersaturation inside the wafer was monitored by the broadening and the consequent peak concentration lowering of the boron spikes. We show that the I depth-penetration strongly depends on the original source lateral size. Moreover, lateral diffusion of I has been observed, being independent of the source size. (C) 2003 Elsevier B.V. All rights reserved.
引用
收藏
页码:148 / 151
页数:4
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