A low cost multichip module using flex substrate and ball grid array

被引：0

作者：

Arnn, DA ^{[1
]}

Parkerson, JP ^{[1
]}

Schaper, LW ^{[1
]}

Ang, SS ^{[1
]}

机构：

[1] UNIV ARKANSAS,HIDEC,FAYETTEVILLE,AR 72701

来源：

1966 INTERNATIONAL CONFERENCE ON MULTICHIP MODULES, PROCEEDINGS | 1996年 / 2794卷

关键词：

flex circuits; ball grid array; MCM; IMPS; solderable conductive ink; encapsulation;

D O I：

暂无

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

引用

页码：28 / 32

页数：5

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