A low cost multichip module using flex substrate and ball grid array

被引：0
|
作者：
Arnn, DA [1 ]
Parkerson, JP [1 ]
Schaper, LW [1 ]
Ang, SS [1 ]
机构：
[1] UNIV ARKANSAS,HIDEC,FAYETTEVILLE,AR 72701
来源：
1966 INTERNATIONAL CONFERENCE ON MULTICHIP MODULES, PROCEEDINGS | 1996年 / 2794卷
关键词：
flex circuits; ball grid array; MCM; IMPS; solderable conductive ink; encapsulation;
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
引用
收藏
页码：28 / 32
页数：5
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