Electron-beam patterned self-assembled monolayers as templates for Cu electrodeposition and lift-off

被引：25

作者：

She, Zhe ^{[1
]}

DiFalco, Andrea ^{[2
]}

Haehner, Georg ^{[1
]}

Buck, Manfred ^{[1
]}

机构：

[1] Univ St Andrews, EaStCHEM Sch Chem, St Andrews KY16 9ST, Fife, Scotland

[2] Univ St Andrews, Sch Phys & Astron, St Andrews KY16 9ST, Fife, Scotland

来源：

BEILSTEIN JOURNAL OF NANOTECHNOLOGY | 2012年 / 3卷

基金：

英国工程与自然科学研究理事会;

关键词：

electrochemical nanotechnology; electrodeposition; lithography; metallic nanostructures; self-assembled monolayers; thiols; ORGANIC MONOLAYERS; VAPOR-DEPOSITION; SURFACE; COPPER; LITHOGRAPHY; FABRICATION; MOLECULES; NANOWIRES; FILMS; ELECTROCHEMISTRY;

D O I：

10.3762/bjnano.3.11

中图分类号：

TB3 [工程材料学];

学科分类号：

0805 ; 080502 ;

摘要：

Self-assembled monolayers (SAMs) of 4'-methylbiphenyl-4-thiol (MBP0) adsorbed on polycrystalline gold substrates served as templates to control electrochemical deposition of Cu structures from acidic solution, and enabled the subsequent lift-off of the metal structures by attachment to epoxy glue. By exploiting the negative-resist behaviour of MBP0, the SAM was patterned by means of electron-beam lithography. For high deposition contrast a two-step procedure was employed involving a nucleation phase around -0.7 V versus Cu2+/Cu and a growth phase at around -0.35 V versus Cu2+/Cu. Structures with features down to 100 nm were deposited and transferred with high fidelity. By using substrates with different surface morphologies, AFM measurements revealed that the roughness of the substrate is a crucial factor but not the only one determining the roughness of the copper surface that is exposed after lift-off.

引用

页码：101 / 113

页数：13

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