Reliability of MEMS: A perspective on failure mechanisms, improvement solutions and best practices at development level

被引:59
|
作者
Iannacci, Jacopo [1 ]
机构
[1] Fdn Bruno Kessler, Ctr Mat & Microsyst, I-38123 Povo, Trento, Italy
关键词
MEMS; Microsystem technology; RF-MEMS; Reliability; Failure mechanisms; Physics of failure; RF; RESONATORS; STRESS; SIMULATION; STICTION; SILICON; FILMS;
D O I
10.1016/j.displa.2014.08.003
中图分类号
TP3 [计算技术、计算机技术];
学科分类号
0812 ;
摘要
Reliability of MEMS (MicroElectroMechanical-Systems) devices is a crucial aspect as it can discriminate the successful from partially or totally missed reaching of Microsystem technology based market products. However, the topic of MEMS reliability is significantly articulated, as it comprises numerous physics of failure and diverse failure mechanisms. Thereafter, it requires a pronounced sensitivity related to the actual operation conditions (environmental and functional) of the Microsystem device within the final application. In other words, reliability of MEMS is nowadays regarded as a standalone transversal discipline that must be seriously taken into account already from the early design phase. The purpose of this paper is to provide the reader at first with basic knowledge around the concept of reliability. Thereafter, the most relevant physics of failure and failure mechanisms typical of MEMS are grouped and briefly discussed, with specific attention to their employment in the field of displays. A synthetic review of valuable solutions to improve specific reliability aspects of MEMS devices for diverse applications is then proposed to the reader. Eventually, a brief discussion focused on best practices to address properly reliability during the whole development chain of innovative MEMS based products completes the contribution. It is a belief of the author that the particular blend of topics and aspects reported in the following pages, as well as the attitude of considering reliability as a transversal discipline of science, contribute to provide this contribution with an important benefit if compared to the reviews on reliability of MEMS previously published in literature. (C) 2014 Elsevier B.V. All rights reserved.
引用
收藏
页码:62 / 71
页数:10
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  • [1] MEMS reliability from a failure mechanisms perspective
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    [J]. MICROELECTRONICS RELIABILITY, 2003, 43 (07) : 1049 - 1060
  • [2] A novel correlative model of failure mechanisms for evaluating MEMS devices reliability
    Li, Yaqiu
    Sun, Yufeng
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    [J]. MICROELECTRONICS RELIABILITY, 2016, 64 : 669 - 675
  • [3] Experimental reliability estimation and improvement for a wafer level vacuum packaged MEMS device
    Choi, MS
    Choa, SH
    [J]. ADVANCES IN FRACTURE AND STRENGTH, PTS 1- 4, 2005, 297-300 : 588 - 593
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    Attanasio, F.
    Cicoira, M.
    Donati, C.
    Ferrario, M.
    Lasala, R.
    Roni, C.
    Russoniello, R.
    Simonelli, C.
    Zanuzzi, M.
    Canonico, P. L.
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  • [5] Reliability Improvement by Detecting Failure Mechanisms Through Advanced Analytics Tools
    Patil, Ranjeet
    [J]. 2022 68TH ANNUAL RELIABILITY AND MAINTAINABILITY SYMPOSIUM (RAMS 2022), 2022,
  • [6] Advanced getter solutions at wafer level to assure high reliability to the last generations MEMs
    Moraja, M
    Amiotti, M
    Kullberg, R
    [J]. 41ST ANNUAL PROCEEDINGS: INTERNATIONAL RELIABILITY PHYSICS SYMPOSIUM, 2003, : 458 - 459
  • [7] BEST PRACTICES FOR SOFT SKILLS DEVELOPMENT AT THE UNDERGRADUATE LEVEL: A EUROPEAN PROJECT
    Cinque, Maria
    [J]. 6TH INTERNATIONAL CONFERENCE OF EDUCATION, RESEARCH AND INNOVATION (ICERI 2013), 2013, : 1266 - 1275
  • [8] A review of the most important failure, reliability and nonlinearity aspects in the development of microelectromechanical systems (MEMS)
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    [J]. MICROELECTRONICS INTERNATIONAL, 2017, 34 (01) : 9 - 21
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