Trends and Challenges in Hot Stamping Technology

被引:1
|
作者
Gharbi, Mohammad M. [1 ]
Palm, Christian [2 ]
机构
[1] Schuler Pressen GmbH, Bahnhofstr 41, D-73033 Goeppingen, Germany
[2] Schuler Pressen GmbH, Louis Schuler Str 1, D-68753 Waghaeusel, Germany
关键词
D O I
10.1063/1.5008063
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
The main motivation for the lightweight concepts in automotive sector is nation and international legislations to decrease the CO2 emission. The use of lightweight technologies or lightweight materials or the combination of both is indispensable. In this paper we present hot stamping as a solution of using lightweight technologies which could be used to produce parts with higher performances. Trends, Challenges and Solutions in hot stamping technologies are discussed. New solution, pressured controlled hardening (PCH-Technology) is presented and discussed.
引用
收藏
页数:6
相关论文
共 50 条
  • [31] New Research Progresses on Hot Stamping Technology of High-Performance Sheet Metal
    Wang, Y. L.
    Zhu, B.
    Zhang, Y. S.
    ADVANCED HIGH STRENGTH STEEL AND PRESS HARDENING, 2017, : 322 - 336
  • [32] Fundamental research and numerical simulation of new hot stamping tool manufactured by surfacing technology
    Shixin Peng
    Jie Zhou
    Mengmeng Zhang
    Kemin Zhang
    Jie Liu
    Jiansheng Zhang
    The International Journal of Advanced Manufacturing Technology, 2020, 107 : 3527 - 3541
  • [33] Trends in automotive electronics and challenges in packaging technology
    Miyake T.
    Journal of Japan Institute of Electronics Packaging, 2019, 22 (07) : 602 - 606
  • [34] Scaling Trends and Challenges of Advanced Memory Technology
    Lee, Seok-Hee
    2014 INTERNATIONAL SYMPOSIUM ON VLSI DESIGN, AUTOMATION AND TEST (VLSI-DAT), 2014,
  • [35] The Fusion of Clinical Guidelines with Technology: Trends & Challenges
    MacDougall, Candice
    McGregor, Carolyn
    Percival, Jennifer
    ELECTRONIC JOURNAL OF HEALTH INFORMATICS, 2010, 5 (02):
  • [36] GNSS Chipset Technology Trends, Opportunities and Challenges
    Rubin, Dimitri
    PROCEEDINGS OF THE 34TH INTERNATIONAL TECHNICAL MEETING OF THE SATELLITE DIVISION OF THE INSTITUTE OF NAVIGATION (ION GNSS+ 2021), 2021, : 2070 - 2081
  • [37] MOS technology: Trends and challenges in the ULSI era
    Shah, A
    Yang, P
    MICROELECTRONICS AND RELIABILITY, 1997, 37 (09): : 1301 - 1307
  • [38] IMPROVING THE QUALITY OF HOT STAMPING PARTS WITH INNOVATIVE PRESS TECHNOLOGY AND INLINE PROCESS CONTROL
    Vollmer, R.
    Palm, C.
    36TH IDDRG CONFERENCE - MATERIALS MODELLING AND TESTING FOR SHEET METAL FORMING, 2017, 896
  • [39] Fundamental research and numerical simulation of new hot stamping tool manufactured by surfacing technology
    Peng, Shixin
    Zhou, Jie
    Zhang, Mengmeng
    Zhang, Kemin
    Liu, Jie
    Zhang, Jiansheng
    INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY, 2020, 107 (7-8): : 3527 - 3541
  • [40] Challenges in nanometer technology scaling: Trends and projections
    Segura, J
    De, V
    Keshavarzi, A
    20TH IEEE VLSI TEST SYMPOSIUM, PROCEEDINGS, 2002, : 447 - 447