Effect of rogue particles on the sub-surface damage of fused silica during grinding/polishing

被引:139
|
作者
Suratwala, T. [1 ]
Steele, R. [1 ]
Feit, M. D. [1 ]
Wong, L. [1 ]
Miller, P. [1 ]
Menapace, J. [1 ]
Davis, P. [1 ]
机构
[1] Lawrence Livermore Natl Lab, Livermore, CA 94551 USA
关键词
fracture; indentation; microindentation; optical microscopy; lasers; silica; processing;
D O I
10.1016/j.jnoncrysol.2007.11.015
中图分类号
TQ174 [陶瓷工业]; TB3 [工程材料学];
学科分类号
0805 ; 080502 ;
摘要
The distribution and characteristics of surface cracks (i.e., sub-surface damage or scratching) on fused silica formed during grinding/polishing resulting from the addition of rogue particles in the base slurry has been investigated. Fused silica samples (10 cm, diameter x I cm thick) were: (1) ground by loose abrasive grinding (alumina particles 9-30 mu m) on a glass lap with the addition of larger alumina particles at various concentrations with mean sizes ranging from 15 to 30 pm, or (2) polished (using 0.5 mu m cerium oxide slurry) on various laps (polyurethane pads or pitch) with the addition of larger rogue particles (diamond (4-45 mu m), pitch, dust, or dried Ceria slurry agglomerates) at various concentrations. For the resulting ground samples, the crack distributions of the as-prepared surfaces were determined using a polished taper technique. The crack depth was observed to: (1) increase at small concentrations (> 10(-4) fraction) of rogue particles; and (2) increase with rogue particle concentration to crack depths consistent with that observed when grinding with particles the size of the rogue particles alone. For the polished samples, which were subsequently etched in HF:NH4F to expose the surface damage, the resulting scratch properties (type, number density, width, and length) were characterized. The number density of scratches increased exponentially with the size of the rogue diamond at a fixed rogue diamond concentration suggesting that larger particles are more likely to lead to scratching. The length of the scratch was found to increase with rogue particle size, increase with lap viscosity, and decrease with applied load. At high diamond concentrations, the type of scratch transitioned from brittle to ductile and the length of the scratches dramatically increased and extended to the edge of the optic. The observed trends can be explained semi-quantitatively in terms of the time needed for a rogue particle to penetrate into a viscoelastic lap. The results of this study provide useful insights and 'rules-of-thumb' relating scratch characteristics observed on surfaces during optical glass fabrication to the characteristics of the rogue particles causing them and their possible source. Published by Elsevier B.V.
引用
收藏
页码:2023 / 2037
页数:15
相关论文
共 50 条
  • [1] Sub-surface mechanical damage distributions during grinding of fused silica
    Suratwala, T.
    Wong, L.
    Miller, P.
    Feit, M. D.
    Menapace, J.
    Steele, R.
    Davis, P.
    Walmer, D.
    JOURNAL OF NON-CRYSTALLINE SOLIDS, 2006, 352 (52-54) : 5601 - 5617
  • [2] The Study of Sub-surface Damage of Fused Silica after Ultrasonic Assisted Grinding Process
    Kuo, Ching-Hsiang
    Huang, Chien-Yao
    Yu, Zong-Ru
    Shu, Shyu-Cheng
    Chang, Keng-Shou
    OPTICAL FABRICATION, TESTING, AND METROLOGY VI, 2018, 10692
  • [3] The size prediction of potential inclusions embedded in the sub-surface of fused silica by damage morphology
    Gao, Xiang
    Qiu, Rong
    Wang, Kunpeng
    Zhang, Jiangmei
    Zhou, Guorui
    Yao, Ke
    Jiang, Yong
    Zhou, Qiang
    OPEN PHYSICS, 2017, 15 (01): : 233 - 239
  • [4] Fixed abrasive polishing: the effect of particle size on the workpiece roughness and sub-surface damage
    Xinyu Luo
    Wei Yang
    Yuan Qian
    The International Journal of Advanced Manufacturing Technology, 2021, 115 : 3021 - 3035
  • [5] Fixed abrasive polishing: the effect of particle size on the workpiece roughness and sub-surface damage
    Luo, Xinyu
    Yang, Wei
    Qian, Yuan
    INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY, 2021, 115 (9-10): : 3021 - 3035
  • [6] The Study of Sub-surface Damage Distributions during Grinding Process on Different Abrasion Materials
    Kuo, Ching-Hsiang
    Huang, Chien-Yao
    Yu, Zong-Ru
    Shu, Shyu-Cheng
    Chang, Keng-Shou
    Hsu, Wei-Yao
    OPTIFAB 2017, 2017, 10448
  • [7] A discrete element model to investigate sub-surface damage due to surface polishing
    Iordanoff, Ivan
    Battentier, A.
    Neauport, J.
    Charles, J. L.
    TRIBOLOGY INTERNATIONAL, 2008, 41 (11) : 957 - 964
  • [8] Effect of grinding parameters on surface roughness and subsurface damage and their evaluation in fused silica
    Xiao, Huapan
    Chen, Zhi
    Wang, Hairong
    Wang, Jiuhong
    Zhu, Nan
    OPTICS EXPRESS, 2018, 26 (04): : 4638 - 4655
  • [9] The effect of parallel modulation on sub-surface damage
    Qu, W
    Miller, MH
    Chandra, A
    PROCEEDINGS OF THE FOURTEENTH ANNUAL MEETING OF THE AMERICAN SOCIETY FOR PRECISION ENGINEERING, 1999, : 119 - 122
  • [10] Chip formation and sub-surface damage in ductile mode grinding of semiconductors
    Uhlmann, E
    Engel, H
    Paesler, C
    PROCEEDINGS OF THE THIRTEENTH ANNUAL MEETING OF THE AMERICAN SOCIETY FOR PRECISION ENGINEERING, 1998, : 626 - 630