A discrete element model to investigate sub-surface damage due to surface polishing

被引:28
|
作者
Iordanoff, Ivan [1 ]
Battentier, A. [1 ]
Neauport, J. [2 ]
Charles, J. L. [1 ]
机构
[1] ENSAM, LAMEFIP, Esplanade Arts & Metiers, F-33405 Talence, France
[2] CEA, CESTA, F-33114 Le Barp, France
关键词
abrasion process; sub-surface damage; wear; DEM (discrete element method); optics; surface finishing;
D O I
10.1016/j.triboint.2008.02.018
中图分类号
TH [机械、仪表工业];
学科分类号
0802 ;
摘要
Large high-power laser facilities such as megajoule laser (LMJ) or National Ignition Facility (NIF) are designed to focus about 2 MJ of energy at the wavelength of 351 nm, in the center of an experiment chamber. The final optic assembly of these systems, operating at 351 nm is made of large fused silica optics working in transmission. When submitted to laser at the wavelength of 351 nm, fused silica optics can exhibit damage, induced by the high amount of energy traversing the part. The created damage is a set of micro-chips that appear on the optic surface. Current researches have shown that this damage could be initiated on pre-existing sub-surface damages created during the optics manufacturing process. It is then very important to understand, for various set of manufacturing parameters, what are the key parameters for sub-surface damage. The presented work details the development of a simplified model to investigate the polishing process. Both silica (the material to be polished) and the abrasive particles are modeled using a discrete element approach. This numerical tool allows following the evolution of micro-cracks inside the material during the abrasion process. It is shown how the mechanical properties (pressure), the abrasive properties (shape and quantity of abrasive particles) and the system properties (filtration) have an influence on the sub-surface properties at the end of the process. (C) 2008 Elsevier Ltd. All rights reserved.
引用
收藏
页码:957 / 964
页数:8
相关论文
共 50 条
  • [1] A QUANTITATIVE DISCRETE ELEMENT MODEL TO INVESTIGATE SUB-SURFACE DAMAGE DUE TO SURFACE POLISHING
    Andre, Damien
    Iordanoff, Ivan
    Charles, Jean-luc
    Neauport, Jerome
    [J]. PROCEEDINGS OF THE ASME 11TH BIENNIAL CONFERENCE ON ENGINEERING SYSTEMS DESIGN AND ANALYSIS, VOL 4, 2012, : 577 - 585
  • [2] Optimizing reactive ion etching to remove sub-surface polishing damage on diamond
    Hicks, Marie-Laure
    Pakpour-Tabrizi, Alexander C.
    Zuerbig, Verena
    Kirste, Lutz
    Nebel, Christoph
    Jackman, Richard B.
    [J]. JOURNAL OF APPLIED PHYSICS, 2019, 125 (24)
  • [4] The relation of surface treatment and sub-surface damage on ZERODUR®
    Jedamzik, Ralf
    Hartmann, Peter
    Burger, Inge
    Westerhoff, Thomas
    [J]. ADVANCES IN OPTICAL AND MECHANICAL TECHNOLOGIES FOR TELESCOPES AND INSTRUMENTATION III, 2018, 10706
  • [5] Effect of rogue particles on the sub-surface damage of fused silica during grinding/polishing
    Suratwala, T.
    Steele, R.
    Feit, M. D.
    Wong, L.
    Miller, P.
    Menapace, J.
    Davis, P.
    [J]. JOURNAL OF NON-CRYSTALLINE SOLIDS, 2008, 354 (18) : 2023 - 2037
  • [6] Fixed abrasive polishing: the effect of particle size on the workpiece roughness and sub-surface damage
    Xinyu Luo
    Wei Yang
    Yuan Qian
    [J]. The International Journal of Advanced Manufacturing Technology, 2021, 115 : 3021 - 3035
  • [7] Study of the sub-surface damage of HgCdTe induced by chemical-mechanical polishing method
    [J]. Qiao, Hui (qiaohui@mail.sitp.ac.cn), 1600, Chinese Society of Astronautics (45):
  • [8] Fixed abrasive polishing: the effect of particle size on the workpiece roughness and sub-surface damage
    Luo, Xinyu
    Yang, Wei
    Qian, Yuan
    [J]. INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY, 2021, 115 (9-10): : 3021 - 3035
  • [9] Sub-surface Damage of Ultra-Thin Monocrystalline Silicon Wafer Induced by Dry Polishing
    Xundi Zhang
    Chenlin Yang
    Yumei Zhang
    Anmin Hu
    Ming Li
    Liming Gao
    Huiqin Ling
    Tao Hang
    [J]. Electronic Materials Letters, 2020, 16 : 355 - 362
  • [10] The effect of parallel modulation on sub-surface damage
    Qu, W
    Miller, MH
    Chandra, A
    [J]. PROCEEDINGS OF THE FOURTEENTH ANNUAL MEETING OF THE AMERICAN SOCIETY FOR PRECISION ENGINEERING, 1999, : 119 - 122