Diffusional bonds in laminated composites produced by ECAP

The microstructure, diffusional and mechanical bonding behavior and microhardness distribution of laminated composites fabricated by ECAP process were investigated. Al-Cu and Cu-Ni laminated composites were produced by ECAP process up to 4 passes at room temperature and high temperature (300 degrees C). The results of microstructure characterization by SEM and shear strength test revealed that the joints between the layers of 4-pass ECAPed samples were considerably stronger than those of 1-pass ECAPed samples due to tolerating higher values of plastic deformations during ECAP. Furthermore, shear strength data showed that increasing ECAP temperature caused a notable increase in shear strength of the specimens. The reason lies in the formation of diffusional joint between the interface of both Al/Cu and Cu/Ni layers at high temperature. The shear bonding strength of ECAPed Cu/Ni/Cu composite at high temperature was remarkably higher than that of ECAPed Cu/Al/Cu composite.