A Wideband Monolithically Integrated Photonic Receiver in 0.25-μm SiGe:C BiCMOS Technology

被引:0
|
作者
Eissa, M. H. [1 ]
Awny, A. [1 ]
Winzer, G. [1 ]
Kroh, M. [1 ]
Lischke, S. [1 ]
Knoll, D. [1 ]
Zimmermann, L. [1 ]
Kissinger, D. [1 ,2 ]
Ulusoy, A. C. [1 ,3 ]
机构
[1] IHP, Technol Pk 25, D-15236 Frankfurt, Oder, Germany
[2] Tech Univ Berlin, Einsteinufer 17, D-10587 Berlin, Germany
[3] Michigan State Univ, ECE Dept, E Lansing, MI 48823 USA
来源
关键词
Electronic photonic integrated circuit; transimpedance amplifier;
D O I
暂无
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
This work presents a 54 Gb/s monolithically integrated silicon photonics receiver (Rx). A germanium photodiode (Ge-PD) is monolithically integrated with a transimpedance amplifier (TIA) and low frequency feedback loop to compensate for the DC input overload current. Bandwidth enhancement techniques are used to extend the bandwidth compared to previously published monolithically integrated receivers. Implemented in a 0.25 mu m SiGe:C BiCMOS electronic/photonic integrated circuit (EPIC) technology, the Rx operates at lambda=1.55 mu m, achieves an optical/electrical (O/E) bandwidth of 47GHz with only +/- 5ps group delay variation and a sensitivity of 0.2dBm for 4.5x10(-11) BER at 40 Gb/s and 0.97dBm for 1.05x10(-6) BER at 54 Gb/s. It dissipates 73mW of power, while occupying 1.6mm(2) of area. To the best of the author's knowledge, this work presents the state-of-the-art bandwidth and bit rate in monolithically integrated photonic receivers.
引用
收藏
页码:487 / 490
页数:4
相关论文
共 50 条
  • [31] A Terahertz Imaging Receiver in 0.13μm SiGe BiCMOS Technology
    Sengupta, Kaushik
    Seo, Dongjin
    Hajimiri, Ali
    2011 36TH INTERNATIONAL CONFERENCE ON INFRARED, MILLIMETER, AND TERAHERTZ WAVES (IRMMW-THZ), 2011,
  • [32] Design of MMIC Subharmonic Mixer for K-band Receiver Based on 0.25 μm SiGe BiCMOS Technology
    Babak, Leonid I.
    Kokolov, Andrey A.
    Sheyerman, Feodor I.
    Pomazanov, Alexey V.
    2019 INTERNATIONAL SIBERIAN CONFERENCE ON CONTROL AND COMMUNICATIONS (SIBCON), 2019,
  • [33] A 60 GHz MIXER USING 0.25 μm SiGe BiCMOS TECHNOLOGY
    Lee, Sang-Heung
    Lee, Ja-Yol
    Kim, Haecheon
    MICROWAVE AND OPTICAL TECHNOLOGY LETTERS, 2008, 50 (12) : 3007 - 3009
  • [34] 10 Gb/s 5 Vpp AND 5.6 Vpp drivers implemented together with a monolithically integrated silicon modulator in 0.25 μm SiGe:C BiCMOS
    Goll, B.
    Thomson, D. J.
    Zimmermann, L.
    Porte, H.
    Gardes, F. Y.
    Hu, Y.
    Reed, G. T.
    Zimmermann, H.
    OPTICS COMMUNICATIONS, 2015, 336 : 224 - 234
  • [35] Radiation tolerant RF-LDMOS transistors, integrated into a 0.25 μm SiGe-BICMOS technology
    Sorge, R.
    Schmidt, J.
    Reimer, F.
    Wipf, Ch.
    Korndoerfer, F.
    Pliquett, R.
    Barth, R.
    NUCLEAR INSTRUMENTS & METHODS IN PHYSICS RESEARCH SECTION A-ACCELERATORS SPECTROMETERS DETECTORS AND ASSOCIATED EQUIPMENT, 2019, 924 : 166 - 169
  • [36] Fully-differential, DC-coupled, Self-biased, Monolithically-integrated Optical Receiver in 0.25 μm Photonic BiCMOS Technology for Multi-channel Fiber Links
    Gudyriev, Sergiy
    Scheytt, J. Christoph
    Yan, Lei
    Meuer, Christian
    Zimmermann, Lars
    2017 IEEE BIPOLAR/BICMOS CIRCUITS AND TECHNOLOGY MEETING (BCTM), 2017, : 110 - 113
  • [37] A New 8 GHz differential 120° Tunable active phase shifter integrated in a 0.25 μm BiCMOS SiGe:C technology
    Jadav, Bhanu Pratap Singh
    Paillot, Jean-Marie
    Cordeau, David
    Kanoun, Mariem
    2019 26TH IEEE INTERNATIONAL CONFERENCE ON ELECTRONICS, CIRCUITS AND SYSTEMS (ICECS), 2019, : 310 - 313
  • [38] An X-Band Slow-Wave T/R Switch in 0.25-μm SiGe BiCMOS
    Dinc, Tolga
    Kalyoncu, Ilker
    Gurbuz, Yasar
    IEEE TRANSACTIONS ON CIRCUITS AND SYSTEMS II-EXPRESS BRIEFS, 2014, 61 (02) : 65 - 69
  • [39] Fabrication of High Bit Rate, Monolithically Integrated Receivers in Photonic BiCMOS Technology
    Knoll, D.
    Lischke, S.
    Zimmermann, L.
    Awny, A.
    Kroh, M.
    Peczek, A.
    Voigt, K.
    Petermann, K.
    2015 IEEE 12TH INTERNATIONAL CONFERENCE ON GROUP IV PHOTONICS (GFP), 2015, : 181 - 182
  • [40] Modular integration of annular TSV structures filled with tungsten in a 0.25 μm SiGe:C BiCMOS technology
    Marschmeyer, S.
    Berthold, J.
    Krueger, A.
    Lisker, M.
    Scheit, A.
    Schulze, S.
    Trusch, A.
    Wietstruck, M.
    Wolansky, D.
    MICROELECTRONIC ENGINEERING, 2015, 137 : 153 - 157