Border Trap Characterizations of Al2O3/ZrO2 and Al2O3/HfO2 Bilayer Films Based on Ambient Post Metal Annealing and Constant Voltage Stress

被引:9
|
作者
Rahman, Md. Mamunur [1 ]
Kim, Dae-Hyun [3 ]
Kim, Tae-Woo [2 ]
机构
[1] Canadian Univ Bangladesh, Dept EEE, Sch Sci & Engn, Dhaka 1213, Bangladesh
[2] Univ Ulsan, Sch Elect Engn, Ulsan 44610, South Korea
[3] Kyungpook Natl Univ, Sch Elect Engn, Daegu 702701, South Korea
基金
新加坡国家研究基金会;
关键词
III-V semiconductor; atomic layer deposition; border trap; constant voltage stress; high-k; interface trap; post metal annealing; GATE DIELECTRICS; OXIDE; HYSTERESIS; CAPACITORS; BEHAVIOR;
D O I
10.3390/nano10030527
中图分类号
O6 [化学];
学科分类号
0703 ;
摘要
This study represents a comparison of the border trap behavior and reliability between HfO2 and ZrO2 films on n-In0.53Ga0.47As with an Al2O3 interfacial layer. The effect of different post metal annealing conditions on the trap response was analyzed and it was found that the N-2:H-2 mixed FGA passivates the border trap quite well, whereas N-2-based RTA performs better on interface traps. Al2O3/HfO2 showed more degradation in terms of the threshold voltage shift while Al2O3/ZrO2 showed higher leakage current behavior. Moreover, Al2O3/ZrO2 showed a higher permittivity, hysteresis, and breakdown field than Al2O3/HfO2.
引用
收藏
页数:12
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