A Tr-Axial Micro-Force Sensor Based on MEMS Technology

被引：0

作者：

Wang, WeiZhong ^{[1
]}

Zhao, YuLong ^{[1
]}

Lin, QiJing ^{[1
]}

Yuan, GuoYing ^{[1
]}

机构：

[1] Xi An Jiao Tong Univ, State Key Lab Mech Mfg Syst, Inst Precis Engn, Xian 710049, Peoples R China

来源：

APPLIED ELECTROMAGNETICS AND MECHANICS (II) | 2009年 / 13卷

关键词：

D O I：

暂无

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

A new novel tii-axial micro-force sensor for robotic application which has the advantages of a minimized structure, high resolution, sensitivity and linearity is presented in this paper. The fabrication on a silicon-on-insulator (SOD wafer utilizes MEMS bulk-micromachining technologies of anisotropic chemical etching and packaging through glass anodic bonding. It uses four deflectable cantilever beams to support a silicon seismic mass at their free ends and an optical fiber probe with a sharp tip is glued on the mass to detect tri-axial micro-force which resolution up to micronewton (uN) scale. The results of the mechanical test of the realised tri-axial micro-force sensor illustrate that the sensor has good characters.

引用

页码：369 / 370

页数：2

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