A Tr-Axial Micro-Force Sensor Based on MEMS Technology

A new novel tii-axial micro-force sensor for robotic application which has the advantages of a minimized structure, high resolution, sensitivity and linearity is presented in this paper. The fabrication on a silicon-on-insulator (SOD wafer utilizes MEMS bulk-micromachining technologies of anisotropic chemical etching and packaging through glass anodic bonding. It uses four deflectable cantilever beams to support a silicon seismic mass at their free ends and an optical fiber probe with a sharp tip is glued on the mass to detect tri-axial micro-force which resolution up to micronewton (uN) scale. The results of the mechanical test of the realised tri-axial micro-force sensor illustrate that the sensor has good characters.