A new procedure for measuring the decohesion energy for thin ductile films on substrates - Reply

被引:1
|
作者
Bagchi, A
Evans, AG
机构
关键词
D O I
10.1557/JMR.1996.0267
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
Large scale yielding (LSY), in general, has a profound influence on the fracture toughness of metal/dielectric interfaces. For thin metal film/dielectric systems exhibiting ''weak'' bonding, small-scale yielding (SSY) prevails due to local plastic dissipation intrinsic to crack growth and the high yield strength of metal thin films. For systems involving low yield strength materials and strong interfaces, a more detailed LSY methodology needs to be developed.
引用
收藏
页码:2112 / 2113
页数:2
相关论文
共 50 条
  • [41] A NEW APPARATUS FOR MEASURING THE ULTIMATE STRAIN OF THIN-FILMS
    ULRICH, RK
    ZHAO, G
    THIN SOLID FILMS, 1993, 224 (01) : 63 - 68
  • [42] NEW METHOD FOR MEASURING DISPERSION IN DIELECTRIC THIN-FILMS
    SHKLYARE.IN
    ELSHAZLI, AF
    OPTICS AND SPECTROSCOPY-USSR, 1971, 31 (05): : 435 - &
  • [43] The method of measuring the thermoelectric power in the thin films of the semimetals and narrow-gap semiconductors formed on the thin substrates
    Demidov, E. V.
    Grabov, V. M.
    Komarov, V. A.
    Suslov, A. V.
    Suslov, M. V.
    13TH INTERNATIONAL CONFERENCE ON FILMS AND COATINGS, 2017, 857
  • [44] Effect of residual stress on the indentation-induced interface delamination mechanism for a hard thin films on an ductile substrates
    Zhou, Ying-Qiang
    Wu, Hua-Ping
    Chai, Guo-Zhong
    Zhang, Zheng
    Bao, Yu-Mei
    Gongcheng Lixue/Engineering Mechanics, 2013, 30 (01): : 69 - 75
  • [45] Numerical estimation of fracture toughness from indentation-induced circumferential cracking in thin films on ductile substrates
    Steffensen, S.
    Madsen, N. D.
    Jensen, H. M.
    INTERNATIONAL JOURNAL OF SOLIDS AND STRUCTURES, 2013, 50 (20-21) : 3406 - 3417
  • [46] Validation of a correction procedure for removing the optical effects from transmission spectra of thin films on substrates
    Milosevic, Milan
    King, Sean W.
    JOURNAL OF APPLIED PHYSICS, 2012, 112 (09)
  • [47] New method of making patterned metal thin films on substrates.
    Luo, Y
    Caswell, KK
    Orendorff, CJ
    Murphy, CJ
    Scrivens, WA
    ABSTRACTS OF PAPERS OF THE AMERICAN CHEMICAL SOCIETY, 2004, 228 : U268 - U268
  • [48] A new method of quantitative evaluation for the adhesive toughness of thin films and substrates
    Kamiya, S
    Inoue, A
    Saka, M
    Abé, H
    MICRO MATERIALS, PROCEEDINGS, 2000, : 377 - 380
  • [49] A NEW ON CHIP NANOMECHANICAL TESTING CONCEPT APPLIED TO BRITTLE AND DUCTILE THIN FILMS MATERIALS
    Pardoen, Thomas
    Safi, Asmahan
    Coulombier, Michael
    Carbonnelle, Pierre
    Raskin, Jean-Pierre
    Gravier, Sebastien
    MICRONANO2008-2ND INTERNATIONAL CONFERENCE ON INTEGRATION AND COMMERCIALIZATION OF MICRO AND NANOSYSTEMS, PROCEEDINGS, 2008, : 259 - 267
  • [50] A NEW APPARATUS FOR MEASURING THERMAL-EXPANSION OF THIN-FILMS
    IWASAKI, Y
    KANEKO, M
    HAYASHI, K
    OCHIAI, Y
    HAYAKAWA, M
    ASO, K
    JOURNAL OF PHYSICS E-SCIENTIFIC INSTRUMENTS, 1989, 22 (07): : 498 - 502