Electrodeposition of Tin Based Film on Copper Plate for Electrocatalytic Reduction of Carbon Dioxide to Formate

被引：12
|
作者：
Lv, Weixin [1 ]
Zhou, Jing [1 ]
Bei, Jingjing [1 ]
Zhang, Rui [1 ]
Kong, Fenying [1 ]
Wang, Wei [1 ]
机构：
[1] Yancheng Inst Technol, Sch Chem & Chem Engn, Yancheng 224051, Peoples R China
来源：
INTERNATIONAL JOURNAL OF ELECTROCHEMICAL SCIENCE | 2016年 / 11卷 / 07期
基金：
中国国家自然科学基金;
关键词：
Electrodeposition; Tin based film; Carbon dioxide; Electrocatalytic reduction; Formate; ELECTROCHEMICAL REDUCTION; FORMIC-ACID; CO2; REDUCTION; FARADAIC EFFICIENCY; METAL-ELECTRODES; CURRENT-DENSITY; SN ELECTRODE; IN-SITU; CATALYSTS; SELECTIVITY;
D O I：
10.20964/2016.07.05
中图分类号：
O646 [电化学、电解、磁化学];
学科分类号：
081704 ;
摘要：
Sn based film with a thickness of 169 nm has been electrodeposited on copper plate from a choline chloride/ethylene glycol based electrolyte containing SnCl2. Electrochemical reduction of carbon dioxide (CO2) has been studied on the prepared Sn based film electrode in KHCO3 aqueous solution. The electrolysis results show that the faradaic efficiency for producing formate is affected by the time of the electrode exposed to air and the electrolysis potential. We find that the Sn based film can improve the electrocatalytic activity for CO2 reduction. The faradaic efficiency for producing formate on the Sn based film electrode (74.1%) is higher than that on the Cu plate electrode.
引用
收藏
页码：6183 / 6191
页数：9
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