Fabrication and assembly of a monolithic 3D CMUT array for Imaging applications

被引:7
|
作者
Cheng, Xiaoyang [1 ]
Chen, Jingkuang [1 ]
Shen, I-Ming [2 ]
Li, Pai-Chi [2 ]
Wang, Mengli [1 ]
机构
[1] Univ New Mexico, Dept Elect & Comp Engn, Albuquerque, NM 87131 USA
[2] Natl Taiwan Univ, Dept Elect Engn, Taipei, Taiwan
关键词
CMUT; IVUS; internal imaging; ultrasound;
D O I
10.1109/ULTSYM.2007.136
中图分类号
O42 [声学];
学科分类号
070206 ; 082403 ;
摘要
This paper describes a novel architecture for integration of polysilicon capacitive micromachined ultrasonic imager array on a 31) hexagonal silicon platform for simultaneous multi-directional viewing. Integrated with seven CMUT arrays oriented at seven different directions, this three-dimensional hexagonal imager prism is capable of viewing the front direction and 360 degrees side directions concurrently. The seven CMUT-array plates were monolithically fabricated on one silicon substrate using a surface micromachining process. The silicon substrate under the connection areas between the imager plates was then completely etched away using a selective backside deep silicon etching, leaving behind flexible dielectric films for inter-plate connection. In addition to providing mechanical linkage, these dielectric connecting films also support the thin-film electrical interconnects between the imagers on different plates. The seven CMUT arrays were then folded into a miniature prism and glued together using epoxy. Hexagonal imager prisms with width across corner of the hexagon, ranging from 500 mu m to 4 millimeters in width, and 2 to 4 millimeters in length have been prototyped and tested. The CMUT devices behaved consistently before and after the assembly process. This architecture allows one monolithically integrated or flip-chip bonded beam-forming circuit to control all the imagers on this miniature prism and the number of bonding wires can be minimized. The multidirection viewing capability and miniature size make this device capable of delivering more comprehensive information for internal medical imaging applications.
引用
收藏
页码:515 / +
页数:2
相关论文
共 50 条
  • [41] Rapid 3D fabrication of micro-optical components for tailored imaging and sensing applications
    Salerni, Antony D.
    Ruiz-Cadalso, Daniel
    Furlong, Cosme
    2021 IEEE RESEARCH AND APPLICATIONS OF PHOTONICS IN DEFENSE CONFERENCE (RAPID), 2021,
  • [42] 3D ULTRASONIC IMAGING APPLICATIONS ON RAILS
    Nguyen, Thompson Vu
    Sternini, Simone
    di Scalea, Francesco Lanza
    PROCEEDINGS OF THE ASME JOINT RAIL CONFERENCE, 2016, 2016,
  • [43] 3D Imaging System for Biometric Applications
    Harding, Kevin
    Abramovich, Gil
    Paruchura, Vijay
    Manickam, Swaminathan
    Vemury, Arun
    THREE-DIMENSIONAL IMAGING, VISUALIZATION, AND DISPLAY 2010 AND DISPLAY TECHNOLOGIES AND APPLICATIONS FOR DEFENSE, SECURITY, AND AVIONICS IV, 2010, 7690
  • [44] Holographic 3D imaging - methods and applications
    Svoboda, J.
    Skeren, M.
    Kveton, M.
    Fiala, P.
    9TH INTERNATIONAL SYMPOSIUM ON DISPLAY HOLOGRAPHY (ISDH 2012), 2013, 415
  • [45] 3D integration technologies for imaging applications
    De Moor, Piet
    NUCLEAR INSTRUMENTS & METHODS IN PHYSICS RESEARCH SECTION A-ACCELERATORS SPECTROMETERS DETECTORS AND ASSOCIATED EQUIPMENT, 2008, 591 (01): : 224 - 228
  • [46] The Evolution of 3D Imaging in Industrial Applications
    Dechow, David
    Photonics Spectra, 2024, 58 (06) : 30 - 36
  • [47] Physics of direct bonding: Applications to 3D heterogeneous or monolithic integration
    Gueguen, Pierric
    Ventosa, Caroline
    Di Cioccio, Lea
    Moriceau, Hubert
    Grossi, Francois
    Rivoire, Maurice
    Leduc, Patrick
    Clavelier, Laurent
    MICROELECTRONIC ENGINEERING, 2010, 87 (03) : 477 - 484
  • [48] A spiral 2D phased array for 3D imaging
    Sumanaweera, TS
    Schwartz, J
    Napolitano, D
    1999 IEEE ULTRASONICS SYMPOSIUM PROCEEDINGS, VOLS 1 AND 2, 1999, : 1271 - 1274
  • [49] MIMO array design for airborne linear array 3D SAR imaging
    Wu, Z.-B. (matinwu@163.com), 2013, Science Press (35):
  • [50] Matrix array inspections in NDT: 3D imaging with the Virtual Array method
    Cosarinsky, Guillermo
    Munoz, M.
    Cruza, Jorge F.
    Brizuela, Jose
    Camacho, Jorge
    2022 IEEE INTERNATIONAL ULTRASONICS SYMPOSIUM (IEEE IUS), 2022,