Copper deposition and its replacement by platinum on a gold electrode

被引：8

作者：

Misicak, Daniel ^{[1
]}

Ruthenburg, Travis C. ^{[1
]}

Fawcett, W. Ronald ^{[1
]}

机构：

[1] Univ Calif Davis, Dept Chem, Davis, CA 95616 USA

来源：

ELECTROCHIMICA ACTA | 2010年 / 55卷 / 26期

基金：

美国国家科学基金会;

关键词：

Electrocatalysis; Underpotential deposition; Electroreduction of oxygen; OXYGEN REDUCTION; SURFACES;

D O I：

10.1016/j.electacta.2010.04.012

中图分类号：

O646 [电化学、电解、磁化学];

学科分类号：

081704 ;

摘要：

The decoration of single crystal gold electrodes with platinum using underpotential deposited copper as an intermediate has been studied in detail. It was found that a significant fraction of the copper is lost in the transfer process from the upd cell to the exchange cell. In addition the surface of the gold is not covered uniformly by the platinum. Nevertheless, acceleration of the electroreduction of oxygen was observed with a loading of 0.14 mu g cm(-2). The structure of the decorating layer was studied by scanning electron microscopy and atomic force microscopy. (C) 2010 Published by Elsevier Ltd.

引用

页码：7610 / 7614

页数：5

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