Cube texture evolution of Ni5W alloy substrates and La-Zr-O buffer layer of YBCO-coated conductors

The cube texture evolution of Ni-5 at%W alloy deformed up to a very high strain was thoroughly investigated by X-ray diffraction (XRD) and electron back-scattered diffraction (EBSD) during the process of deformation, recrystallization and grain growth. A typical copper-type rolling texture, mainly consisting of components of S, copper and brass orientations, is obtained after heavy cold rolling. The fraction of rolling texture is slightly strengthened during recovery and then strongly reduced during recrystallization process. The cube texture is formed by consuming the rolling texture components during the discontinuous recrystallization process. The cube grains have a size advantage with respect to the non-cube grains. A strong cube-textured Ni5W alloy substrate with cube texture area fraction of 98.2 % (<10 degrees) is obtained after annealing at 1050 degrees C for 1 h. The full width half maximum (FWHM) values for the X-ray (111) phi-scan and the (002) omega-scan of this substrate are 5.84 degrees and 4.76 degrees, respectively. Furthermore, the area fraction of {001} < 110 & rang; orientation of the epitaxially grown La2Zr2O7 buffer layer is 97.1 % (<10 degrees), and the FWHM values of (111) phi-scan and (002) omega-scan are 5.22 degrees and 5.00 degrees, respectively.