Evaluation of the thermal performance of high-power LED using magnesium oxide thin film as heat spreader

被引:2
|
作者
Idris, Muhammad Sani [1 ,2 ]
Shanmugan, Subramani [1 ]
机构
[1] Univ Sains Malaysia USM, Sch Phys, George Town 11800, Malaysia
[2] Fed Coll Educ, Dept Phys, Kano, Nigeria
关键词
MgO thin film; The heat spreader; Thermal conductivity; Thermal transient; Thermal impedance; FILLED EPOXY COMPOSITE;
D O I
10.1016/j.matchemphys.2021.125588
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
The spin coating technique was used to synthesize MgO thin film on aluminium substrates. XRD diffraction proved the presence of (200), (220) and (222) MgO phase orientations. Film thickness (370 nm), the crystal size of 17.14 nm, low surface roughness of 12.8 nm and thermal conductivity (22.68 W/mK) were recorded for MgO film sample prepared from 0.6 M concentration. A noticeable reduction in junction temperature (Delta TJ -20.11 degrees C) and total thermal resistance (Delta Rth-tot -3.22 K/W) were recorded for LED fixed on 0.6 M MgO thin film sample. 8% reduction of thermal impedance was also recorded for the prepared film and proving it is free from internal structure degradation. Overall, a noticeable improvement in thermal performance of high-power LED was achieved with MgO thin film as a heat spreader and suggested it as a future alternative to the commercially available film-based heat spreader.
引用
收藏
页数:11
相关论文
共 50 条
  • [31] Thermal Performance of AlN-Coated High-Power LED Optimized Using Taguchi Statistical Approach
    Liu, Chien-Chung
    Sheen, Maw-Tyan
    Chen, Feng-Ming
    Jean, Ming-Der
    JOURNAL OF ELECTRONIC MATERIALS, 2023, 52 (06) : 3706 - 3718
  • [32] Improved Thermal Performance of High-Power LED by Using Low-temperature Sintered Chip Attachment
    Wang, T.
    Lei, G.
    Chen, X.
    Guido, L.
    Ngo, Khai
    Lu, G-Q.
    2009 INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY & HIGH DENSITY PACKAGING (ICEPT-HDP 2009), 2009, : 505 - +
  • [33] Improved thermal design of fin heat sink for high-power LED lamp cooling
    Huang, Yicang
    Shen, Shengnan
    Li, Hui
    Gu, Yunjie
    2016 17TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2016, : 1069 - 1074
  • [34] Analysis of thermal flow around heat sink with ionic wind for high-power LED
    Shin, Dong Ho
    Sohn, Dong Kee
    Ko, Han Seo
    APPLIED THERMAL ENGINEERING, 2018, 143 : 376 - 384
  • [35] Evaluation of high-power LED floodlight luminaires using CAE techniques
    Baek, S. M.
    Jung, J. G.
    Kim, H. J.
    JOURNAL OF CERAMIC PROCESSING RESEARCH, 2012, 13 : S355 - S358
  • [36] Thermal characterization of spray impingement heat transfer over a High-Power LED module
    Sahu, Gopinath
    Khandekar, Sameer
    Muralidhar, K.
    THERMAL SCIENCE AND ENGINEERING PROGRESS, 2022, 32
  • [37] Novel Device Design for High-Power InGaN/Sapphire LEDs Using Copper Heat Spreader With Reflector
    Horng, Ray-Hua
    Hsiao, Hsiang-Yun
    Chiang, Cheng-Chung
    Wuu, Dong-Sing
    Tsai, Yu-Li
    Lin, Heng-I.
    IEEE JOURNAL OF SELECTED TOPICS IN QUANTUM ELECTRONICS, 2009, 15 (04) : 1281 - 1286
  • [38] Using peristaltic pump to charge micro heat pipe for high-power LED
    Li, Congming
    Luo, Yi
    Zhou, Chuanpeng
    Shan, Qing
    Wang, Xiaodong
    2015 IEEE 10TH INTERNATIONAL CONFERENCE ON NANO/MICRO ENGINEERED AND MOLECULAR SYSTEMS (NEMS), 2015, : 164 - 167
  • [39] Thermal design of high-power LED package and system
    Shin, Moo Whan
    ADVANCED LEDS FOR SOLID STATE LIGHTING, 2006, 6355
  • [40] Thermal management of high-power white LED package
    Cheng, Qian
    ICEPT: 2007 8TH INTERNATIONAL CONFERENCE ON ELECTRONICS PACKAGING TECHNOLOGY, PROCEEDINGS, 2007, : 230 - 233