New physical analysis capability for counterfeit electronics and reverse engineering

被引：1

作者：

Johnson, Greg M. ^{[1
]}

Hartfield, Cheryl ^{[2
]}

Mueller, Sascha ^{[3
]}

Kaestner, Marcus ^{[3
]}

机构：

[1] ZEISS Res Microscopy Solut, Peabody, MA 01960 USA

[2] ZEISS SMT, Proc Control Solut, Pleasanton, CA USA

[3] ZEISS SMT, Proc Control Solut, Oberkochen, Germany

来源：

PROCEEDINGS OF THE 2020 IEEE INTERNATIONAL CONFERENCE ON PHYSICAL ASSURANCE AND INSPECTION ON ELECTRONICS (PAINE) | 2020年

关键词：

FIB-SEM; laser; sample preparation; counterfeit; cybersecurity;

D O I：

10.1109/PAINE49178.2020.9337737

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

a new cross-section workflow for improved access to buried structures within electronic devices has been developed. A focused-ion beam scanning-electron microscope (FIB-SEM) system has been integrated by attaching a femtosecond laser to the loadlock chamber, enabling rapid site-specific preparation of internal device details. Evidence is provided that compared with traditional techniques, this new workflow enabled by the Crossbeam laser FIB-SEM offers improved speed and productivity, while simultaneously delivering more precise dimensional sampling and reduced damage to the surrounding area.

引用

页数：5

共 50 条

[31] ELECTRONICS AND RADIO ENGINEERING DISCRETE SCANNING DEVICE FOR AUTOMATION OF PHYSICAL RESEARCH
KOLOSOV, SS
LEONOV, YI
LITVINEN.LN
PRIBORY I TEKHNIKA EKSPERIMENTA, 1974, (05): : 58 - 60
[32] THE ELECTROMAGNETIC-SPECTRUM AND THE CHARACTERISTICS OF PHYSICAL EXPERIMENTATION IN RADIO ENGINEERING AND ELECTRONICS
SRETENSKIY, VN
TELECOMMUNICATIONS AND RADIO ENGINEERING, 1992, 47 (03) : 106 - 111
[33] A NEW COURSE ON PRODUCT DEVELOPMENT FOR ELECTRONICS ENGINEERING TECHNOLOGY
Morgan, Joseph A.
Porter, Jay R.
Zhan, Wei
2013 ASEE ANNUAL CONFERENCE, 2013,
[34] Physical and Functional Reverse Engineering Challenges for Advanced Semiconductor Solutions
Lippmann, Bernhard
Bette, Ann-Christin
Ludwig, Matthias
Mutter, Johannes
Baehr, Johanna
Hepp, Alexander
Gieser, Horst
Kovac, Nicola
Zweifel, Tobias
Rasche, Martin
Kellermann, Oliver
Proceedings of the 2022 Design, Automation and Test in Europe Conference and Exhibition, DATE 2022, 2022, : 796 - 801
[35] A New Algorithm for Feature Matching in Reverse Engineering
Zhu, Gensong
Zhou, Tianrui
Zhou, Jie
Tsinghua Science and Technology, 2009, 14 (SUPPL. 1): : 43 - 46
[36] Physical and Functional Reverse Engineering Challenges for Advanced Semiconductor Solutions
Lippmann, Bernhard
Bette, Ann-Christin
Ludwig, Matthias
Mutter, Johannes
Baehr, Johanna
Hepp, Alexander
Gieser, Horst
Kovac, Nicola
Zweifel, Tobias
Rasche, Martin
Kellermann, Oliver
PROCEEDINGS OF THE 2022 DESIGN, AUTOMATION & TEST IN EUROPE CONFERENCE & EXHIBITION (DATE 2022), 2022, : 796 - 801
[37] Reverse engineering strategy for new targets identification
Xie, Bin
Zhang, Taimei
Li, Le
Chen, Hongkui
Liu, Yang
Bi, Lintao
Wen, Danyi
CANCER RESEARCH, 2024, 84 (06)
[38] A New Algorithm for Feature Matching in Reverse Engineering
朱根松
周天瑞
周捷
TsinghuaScienceandTechnology, 2009, 14(S1) (S1) : 43 - 46
[39] A new method of reverse engineering for an automation process
Bliedtner, J.
Schwartze, S.
Annals of DAAAM for 2003 & Proceedings of the 14th International DAAAM Symposium: INTELLIGENT MANUFACTURING & AUTOMATION: FOCUS ON RECONSTRUCTION AND DEVELOPMENT, 2003, : 49 - 50
[40] Functional Electronic Clones - the most dangerous NEW counterfeit threat facing the ENTIRE Electronics Industry today
Sharpe, Thomas
ISTFA 2015: CONFERENCE PROCEEDINGS FROM THE 41ST INTERNATIONAL SYMPOSIUM FOR TESTING AND FAILURE ANALYSIS, 2015, : 177 - 178

← 1 2 3 4 5 →