Electronic packaging of imaging modules

Imaging modules are image capture devices that convert light and power to a digital signal. An imaging module has been designed developed and manufactured that integrates an optics system and mechanical components with electronic packaging. This integration process, called optomechatronics, results in considerable savings in size, weight, cycle time, and cost over non-integrated image sensor packaging technologies. Integration also leads to improvements in the performance of the image capture system. Most of the imaging module manufacturing and testing process takes place in Class 10000 and Class 100 cleanrooms to avoid contamination. The optomechatronics design and manufacturing process has helped to address concerns with process temperature constraints (due to image sensor die materials), optics mechanism alignment, moisture ingress, and thermal mismatch. New processes were developed to keep process temperatures below 100 degrees C while still maintaining reasonable cycle times. Alignment issues between the image sensor and optics system were minimized by designing in mechanical features that constrain placement to a very narrow window. Moisture concerns were decreased through a combination of design, materials selection, and manufacturing processes. Thermal and mechanical modeling was used to minimize thermal mismatch between the different materials in the imaging module. Reliability tests are ongoing to determine the effects of environmental stresses on image qualify and package performance.