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- [41] Inorganic Materials and Assembly Techniques for Flexible and Stretchable ElectronicsPROCEEDINGS OF THE IEEE, 2015, 103 (04) : 619 - 632He, Junwen论文数: 0 引用数: 0 h-index: 0机构: Univ Illinois, Dept Chem, Urbana, IL 61801 USA Univ Illinois, Dept Chem, Urbana, IL 61801 USANuzzo, Ralph G.论文数: 0 引用数: 0 h-index: 0机构: Univ Illinois, Dept Chem, Dept Mat Sci & Engn, Urbana, IL 61801 USA Univ Illinois, Dept Chem, Urbana, IL 61801 USARogers, John A.论文数: 0 引用数: 0 h-index: 0机构: Univ Illinois, Dept Chem, Dept Mat Sci & Engn, Urbana, IL 61801 USA Univ Illinois, Dept Chem, Urbana, IL 61801 USA
- [42] Transfer printing techniques for flexible and stretchable inorganic electronicsnpj Flexible Electronics, 2Changhong Linghu论文数: 0 引用数: 0 h-index: 0机构: Zhejiang University,Department of Engineering Mechanics, Soft Matter Research Center, and Key Laboratory of Soft Machines and Smart Devices of Zhejiang ProvinceShun Zhang论文数: 0 引用数: 0 h-index: 0机构: Zhejiang University,Department of Engineering Mechanics, Soft Matter Research Center, and Key Laboratory of Soft Machines and Smart Devices of Zhejiang ProvinceChengjun Wang论文数: 0 引用数: 0 h-index: 0机构: Zhejiang University,Department of Engineering Mechanics, Soft Matter Research Center, and Key Laboratory of Soft Machines and Smart Devices of Zhejiang ProvinceJizhou Song论文数: 0 引用数: 0 h-index: 0机构: Zhejiang University,Department of Engineering Mechanics, Soft Matter Research Center, and Key Laboratory of Soft Machines and Smart Devices of Zhejiang Province
- [43] Recent Advances in Flexible/Stretchable Supercapacitors for Wearable ElectronicsSMALL, 2018, 14 (43)Li, La论文数: 0 引用数: 0 h-index: 0机构: Chinese Acad Sci, Inst Semicond, State Key Lab Superlattices & Microstruct, Beijing 100083, Peoples R China Jilin Univ, Key Lab Phys & Technol Adv Batteries, Minist Educ, Changchun 130012, Jilin, Peoples R China Chinese Acad Sci, Inst Semicond, State Key Lab Superlattices & Microstruct, Beijing 100083, Peoples R ChinaLou, Zheng论文数: 0 引用数: 0 h-index: 0机构: Chinese Acad Sci, Inst Semicond, State Key Lab Superlattices & Microstruct, Beijing 100083, Peoples R China Chinese Acad Sci, Inst Semicond, State Key Lab Superlattices & Microstruct, Beijing 100083, Peoples R ChinaChen, Di论文数: 0 引用数: 0 h-index: 0机构: Univ Sci & Technol Beijing, Coll Phys & Math, Beijing 100083, Peoples R China Univ Sci & Technol Beijing, Beijing Key Lab Magnetophotoelect Composite & Int, Beijing 100083, Peoples R China Chinese Acad Sci, Inst Semicond, State Key Lab Superlattices & Microstruct, Beijing 100083, Peoples R ChinaJiang, Kai论文数: 0 引用数: 0 h-index: 0机构: Chinese Peoples Liberat Army Gen Hosp, Chinese PLA Med Sch, Key Lab Digital Hepatobiliary Surg Chinese PLA, Inst & Hosp Hepatobiliary Surg, Beijing 100853, Peoples R China Chinese Acad Sci, Inst Semicond, State Key Lab Superlattices & Microstruct, Beijing 100083, Peoples R ChinaHan, Wei论文数: 0 引用数: 0 h-index: 0机构: Jilin Univ, Key Lab Phys & Technol Adv Batteries, Minist Educ, Changchun 130012, Jilin, Peoples R China Chinese Acad Sci, Inst Semicond, State Key Lab Superlattices & Microstruct, Beijing 100083, Peoples R ChinaShen, Guozhen论文数: 0 引用数: 0 h-index: 0机构: Chinese Acad Sci, Inst Semicond, State Key Lab Superlattices & Microstruct, Beijing 100083, Peoples R China Univ Chinese Acad Sci, Coll Mat Sci & Optoelect Technol, Beijing 100029, Peoples R China Chinese Acad Sci, Inst Semicond, State Key Lab Superlattices & Microstruct, Beijing 100083, Peoples R China
- [44] Immunologic and Tissue Biocompatibility of Flexible/Stretchable Electronics and OptoelectronicsADVANCED HEALTHCARE MATERIALS, 2014, 3 (04) : 515 - 525Park, Gayoung论文数: 0 引用数: 0 h-index: 0机构: Korea Univ, Coll Med, Dept Biochem & Mol Biol, Global Res Lab, Seoul 136713, South Korea Korea Univ, Coll Med, Dept Biochem & Mol Biol, Global Res Lab, Seoul 136713, South KoreaChung, Hyun-Joong论文数: 0 引用数: 0 h-index: 0机构: Univ Illinois, Beckman Inst Adv Sci & Technol, Dept Mat Sci & Engn, Urbana, IL 61801 USA Univ Illinois, Frederick Seitz Mat Res Lab, Urbana, IL 61801 USA Univ Alberta, Dept Chem & Mat Engn, Edmonton, AB T6G 2V4, Canada Korea Univ, Coll Med, Dept Biochem & Mol Biol, Global Res Lab, Seoul 136713, South KoreaKim, Kwanghee论文数: 0 引用数: 0 h-index: 0机构: Korea Univ, Coll Med, Dept Biochem & Mol Biol, Global Res Lab, Seoul 136713, South Korea Korea Univ, Coll Med, Dept Biochem & Mol Biol, Global Res Lab, Seoul 136713, South KoreaLim, Seon Ah论文数: 0 引用数: 0 h-index: 0机构: Korea Univ, Coll Med, Dept Biochem & Mol Biol, Global Res Lab, Seoul 136713, South Korea Korea Univ, Coll Med, Dept Biochem & Mol Biol, Global Res Lab, Seoul 136713, South KoreaKim, Jiyoung论文数: 0 引用数: 0 h-index: 0机构: Korea Univ, Coll Med, Dept Biochem & Mol Biol, Global Res Lab, Seoul 136713, South Korea Korea Univ, Coll Med, Dept Biochem & Mol Biol, Global Res Lab, Seoul 136713, South KoreaKim, Yun-Soung论文数: 0 引用数: 0 h-index: 0机构: Univ Illinois, Beckman Inst Adv Sci & Technol, Dept Mat Sci & Engn, Urbana, IL 61801 USA Univ Illinois, Frederick Seitz Mat Res Lab, Urbana, IL 61801 USA Korea Univ, Coll Med, Dept Biochem & Mol Biol, Global Res Lab, Seoul 136713, South KoreaLiu, Yuhao论文数: 0 引用数: 0 h-index: 0机构: Univ Illinois, Beckman Inst Adv Sci & Technol, Dept Mat Sci & Engn, Urbana, IL 61801 USA Univ Illinois, Frederick Seitz Mat Res Lab, Urbana, IL 61801 USA Korea Univ, Coll Med, Dept Biochem & Mol Biol, Global Res Lab, Seoul 136713, South KoreaYeo, Woon-Hong论文数: 0 引用数: 0 h-index: 0机构: Univ Illinois, Beckman Inst Adv Sci & Technol, Dept Mat Sci & Engn, Urbana, IL 61801 USA Univ Illinois, Frederick Seitz Mat Res Lab, Urbana, IL 61801 USA Korea Univ, Coll Med, Dept Biochem & Mol Biol, Global Res Lab, Seoul 136713, South KoreaKim, Rak-Hwan论文数: 0 引用数: 0 h-index: 0机构: Univ Illinois, Beckman Inst Adv Sci & Technol, Dept Mat Sci & Engn, Urbana, IL 61801 USA Univ Illinois, Frederick Seitz Mat Res Lab, Urbana, IL 61801 USA Korea Univ, Coll Med, Dept Biochem & Mol Biol, Global Res Lab, Seoul 136713, South KoreaKim, Stanley S.论文数: 0 引用数: 0 h-index: 0机构: Univ Illinois, Beckman Inst Adv Sci & Technol, Dept Mat Sci & Engn, Urbana, IL 61801 USA Univ Illinois, Frederick Seitz Mat Res Lab, Urbana, IL 61801 USA Korea Univ, Coll Med, Dept Biochem & Mol Biol, Global Res Lab, Seoul 136713, South KoreaKim, Jong-Seon论文数: 0 引用数: 0 h-index: 0机构: Univ Illinois, Beckman Inst Adv Sci & Technol, Dept Mat Sci & Engn, Urbana, IL 61801 USA Univ Illinois, Frederick Seitz Mat Res Lab, Urbana, IL 61801 USA Korea Univ, Coll Med, Dept Biochem & Mol Biol, Global Res Lab, Seoul 136713, South KoreaJung, Yei Hwan论文数: 0 引用数: 0 h-index: 0机构: Univ Illinois, Beckman Inst Adv Sci & Technol, Dept Mat Sci & Engn, Urbana, IL 61801 USA Univ Illinois, Frederick Seitz Mat Res Lab, Urbana, IL 61801 USA Korea Univ, Coll Med, Dept Biochem & Mol Biol, Global Res Lab, Seoul 136713, South KoreaKim, Tae-Il论文数: 0 引用数: 0 h-index: 0机构: Univ Illinois, Beckman Inst Adv Sci & Technol, Dept Mat Sci & Engn, Urbana, IL 61801 USA Univ Illinois, Frederick Seitz Mat Res Lab, Urbana, IL 61801 USA Sungkyunkwan Univ SKKU, Sch Chem Engn, Suwon 440746, South Korea Korea Univ, Coll Med, Dept Biochem & Mol Biol, Global Res Lab, Seoul 136713, South KoreaYee, Cassian论文数: 0 引用数: 0 h-index: 0机构: UT MD Anderson Canc Ctr, Dept Melanoma Med Oncol & Immunol, Houston, TX 77030 USA Korea Univ, Coll Med, Dept Biochem & Mol Biol, Global Res Lab, Seoul 136713, South KoreaRogers, John A.论文数: 0 引用数: 0 h-index: 0机构: Univ Illinois, Beckman Inst Adv Sci & Technol, Dept Mat Sci & Engn, Urbana, IL 61801 USA Univ Illinois, Frederick Seitz Mat Res Lab, Urbana, IL 61801 USA Korea Univ, Coll Med, Dept Biochem & Mol Biol, Global Res Lab, Seoul 136713, South KoreaLee, Kyung-Mi论文数: 0 引用数: 0 h-index: 0机构: Korea Univ, Coll Med, Dept Biochem & Mol Biol, Global Res Lab, Seoul 136713, South Korea Korea Univ, Coll Med, Dept Biochem & Mol Biol, Global Res Lab, Seoul 136713, South Korea
- [45] Materials and Design Considerations for Fast Flexible and Stretchable Electronics2015 IEEE INTERNATIONAL ELECTRON DEVICES MEETING (IEDM), 2015,Ma, Zhenqiang论文数: 0 引用数: 0 h-index: 0机构: Univ Wisconsin, Dept Elect & Comp Engn, 1415 Johnson Dr, Madison, WI 53706 USA Univ Wisconsin, Dept Elect & Comp Engn, 1415 Johnson Dr, Madison, WI 53706 USAJung, Yei Hwan论文数: 0 引用数: 0 h-index: 0机构: Univ Wisconsin, Dept Elect & Comp Engn, 1415 Johnson Dr, Madison, WI 53706 USA Univ Wisconsin, Dept Elect & Comp Engn, 1415 Johnson Dr, Madison, WI 53706 USASeo, Jung-Hun论文数: 0 引用数: 0 h-index: 0机构: Univ Wisconsin, Dept Elect & Comp Engn, 1415 Johnson Dr, Madison, WI 53706 USA Univ Wisconsin, Dept Elect & Comp Engn, 1415 Johnson Dr, Madison, WI 53706 USAChang, Tzu-Hsuan论文数: 0 引用数: 0 h-index: 0机构: Univ Wisconsin, Dept Elect & Comp Engn, 1415 Johnson Dr, Madison, WI 53706 USA Univ Wisconsin, Dept Elect & Comp Engn, 1415 Johnson Dr, Madison, WI 53706 USACho, Sang June论文数: 0 引用数: 0 h-index: 0机构: Univ Wisconsin, Dept Elect & Comp Engn, 1415 Johnson Dr, Madison, WI 53706 USA Univ Wisconsin, Dept Elect & Comp Engn, 1415 Johnson Dr, Madison, WI 53706 USALee, Juhwan论文数: 0 引用数: 0 h-index: 0机构: Univ Wisconsin, Dept Elect & Comp Engn, 1415 Johnson Dr, Madison, WI 53706 USA Univ Wisconsin, Dept Elect & Comp Engn, 1415 Johnson Dr, Madison, WI 53706 USAZhang, Huilong论文数: 0 引用数: 0 h-index: 0机构: Univ Wisconsin, Dept Elect & Comp Engn, 1415 Johnson Dr, Madison, WI 53706 USA Univ Wisconsin, Dept Elect & Comp Engn, 1415 Johnson Dr, Madison, WI 53706 USAZhou, Weidong论文数: 0 引用数: 0 h-index: 0机构: Univ Texas Arlington, Dept Elect Engn, Arlington, TX 76019 USA Univ Wisconsin, Dept Elect & Comp Engn, 1415 Johnson Dr, Madison, WI 53706 USA
- [46] Self-healing materials for flexible and stretchable electronicsMATERIALS TODAY PHYSICS, 2024, 44He, Linlong论文数: 0 引用数: 0 h-index: 0机构: Hunan Univ Technol, Sch Packaging Design & Art, Zhuzhou 412007, Peoples R China Hunan Univ Technol, Sch Packaging & Mat Engn, Zhuzhou 412007, Peoples R China Wuhan Univ, Sch Phys & Technol, Lab Printable Funct Mat & Printed Elect, Wuhan 430072, Peoples R China Hunan Univ Technol, Sch Packaging Design & Art, Zhuzhou 412007, Peoples R ChinaShi, Jiaqi论文数: 0 引用数: 0 h-index: 0机构: Wuhan Univ, Sch Phys & Technol, Lab Printable Funct Mat & Printed Elect, Wuhan 430072, Peoples R China Hunan Univ Technol, Sch Packaging Design & Art, Zhuzhou 412007, Peoples R ChinaTian, Bin论文数: 0 引用数: 0 h-index: 0机构: Wuhan Univ, Sch Phys & Technol, Lab Printable Funct Mat & Printed Elect, Wuhan 430072, Peoples R China Hunan Univ Technol, Sch Packaging Design & Art, Zhuzhou 412007, Peoples R ChinaZhu, Heping论文数: 0 引用数: 0 h-index: 0机构: Hunan Univ Technol, Sch Packaging Design & Art, Zhuzhou 412007, Peoples R China Hunan Univ Technol, Sch Packaging & Mat Engn, Zhuzhou 412007, Peoples R China Hunan Univ Technol, Sch Packaging Design & Art, Zhuzhou 412007, Peoples R ChinaWu, Wei论文数: 0 引用数: 0 h-index: 0机构: Wuhan Univ, Sch Phys & Technol, Lab Printable Funct Mat & Printed Elect, Wuhan 430072, Peoples R China Hunan Univ Technol, Sch Packaging Design & Art, Zhuzhou 412007, Peoples R China
- [47] Advanced Stretchable Aerogels and Foams for Flexible Electronics and BeyondADVANCED FUNCTIONAL MATERIALS, 2024, 34 (48)Liang, Xing论文数: 0 引用数: 0 h-index: 0机构: Tongji Univ, Interdisciplinary Mat Res Ctr, Sch Mat Sci & Engn, Dept Polymer Mat, Shanghai 201804, Peoples R China Tongji Univ, Interdisciplinary Mat Res Ctr, Sch Mat Sci & Engn, Dept Polymer Mat, Shanghai 201804, Peoples R ChinaSun, Qi论文数: 0 引用数: 0 h-index: 0机构: Tongji Univ, Interdisciplinary Mat Res Ctr, Sch Mat Sci & Engn, Dept Polymer Mat, Shanghai 201804, Peoples R China Tongji Univ, Interdisciplinary Mat Res Ctr, Sch Mat Sci & Engn, Dept Polymer Mat, Shanghai 201804, Peoples R ChinaZhang, Xiaoyu论文数: 0 引用数: 0 h-index: 0机构: Tongji Univ, Interdisciplinary Mat Res Ctr, Sch Mat Sci & Engn, Dept Polymer Mat, Shanghai 201804, Peoples R China Tongji Univ, Interdisciplinary Mat Res Ctr, Sch Mat Sci & Engn, Dept Polymer Mat, Shanghai 201804, Peoples R ChinaHu, Zhenyu论文数: 0 引用数: 0 h-index: 0机构: Tongji Univ, Interdisciplinary Mat Res Ctr, Sch Mat Sci & Engn, Dept Polymer Mat, Shanghai 201804, Peoples R China Tongji Univ, Interdisciplinary Mat Res Ctr, Sch Mat Sci & Engn, Dept Polymer Mat, Shanghai 201804, Peoples R ChinaLiu, Muxiang论文数: 0 引用数: 0 h-index: 0机构: Tongji Univ, Interdisciplinary Mat Res Ctr, Sch Mat Sci & Engn, Dept Polymer Mat, Shanghai 201804, Peoples R China Tongji Univ, Interdisciplinary Mat Res Ctr, Sch Mat Sci & Engn, Dept Polymer Mat, Shanghai 201804, Peoples R ChinaGu, Puzhong论文数: 0 引用数: 0 h-index: 0机构: Tongji Univ, Interdisciplinary Mat Res Ctr, Sch Mat Sci & Engn, Dept Polymer Mat, Shanghai 201804, Peoples R China Tongji Univ, Interdisciplinary Mat Res Ctr, Sch Mat Sci & Engn, Dept Polymer Mat, Shanghai 201804, Peoples R ChinaYang, Xiao论文数: 0 引用数: 0 h-index: 0机构: Tongji Univ, Interdisciplinary Mat Res Ctr, Sch Mat Sci & Engn, Dept Polymer Mat, Shanghai 201804, Peoples R China Tongji Univ, Interdisciplinary Mat Res Ctr, Sch Mat Sci & Engn, Dept Polymer Mat, Shanghai 201804, Peoples R ChinaZu, Guoqing论文数: 0 引用数: 0 h-index: 0机构: Tongji Univ, Interdisciplinary Mat Res Ctr, Sch Mat Sci & Engn, Dept Polymer Mat, Shanghai 201804, Peoples R China Tongji Univ, Interdisciplinary Mat Res Ctr, Sch Mat Sci & Engn, Dept Polymer Mat, Shanghai 201804, Peoples R China
- [48] An analytical model of strain isolation for stretchable and flexible electronicsAPPLIED PHYSICS LETTERS, 2011, 98 (06)Cheng, H.论文数: 0 引用数: 0 h-index: 0机构: Northwestern Univ, Dept Mech Engn, Evanston, IL 60208 USA Northwestern Univ, Dept Civil & Environm Engn, Evanston, IL 60208 USA Northwestern Univ, Dept Mech Engn, Evanston, IL 60208 USAWu, J.论文数: 0 引用数: 0 h-index: 0机构: Northwestern Univ, Dept Mech Engn, Evanston, IL 60208 USA Northwestern Univ, Dept Civil & Environm Engn, Evanston, IL 60208 USA Northwestern Univ, Dept Mech Engn, Evanston, IL 60208 USALi, M.论文数: 0 引用数: 0 h-index: 0机构: Northwestern Univ, Dept Mech Engn, Evanston, IL 60208 USA Northwestern Univ, Dept Civil & Environm Engn, Evanston, IL 60208 USA Dalian Univ Technol, State Key Lab Struct Anal Ind Equipment, Dalian 116024, Peoples R China Northwestern Univ, Dept Mech Engn, Evanston, IL 60208 USAKim, D. -H.论文数: 0 引用数: 0 h-index: 0机构: Univ Illinois, Dept Mat Sci & Engn, Mat Res Lab, Urbana, IL 61801 USA Univ Illinois, Beckman Inst, Urbana, IL 61801 USA Northwestern Univ, Dept Mech Engn, Evanston, IL 60208 USAKim, Y. -S.论文数: 0 引用数: 0 h-index: 0机构: Univ Illinois, Dept Mat Sci & Engn, Mat Res Lab, Urbana, IL 61801 USA Univ Illinois, Beckman Inst, Urbana, IL 61801 USA Northwestern Univ, Dept Mech Engn, Evanston, IL 60208 USAHuang, Y.论文数: 0 引用数: 0 h-index: 0机构: Northwestern Univ, Dept Mech Engn, Evanston, IL 60208 USA Northwestern Univ, Dept Civil & Environm Engn, Evanston, IL 60208 USA Northwestern Univ, Dept Mech Engn, Evanston, IL 60208 USAKang, Z.论文数: 0 引用数: 0 h-index: 0机构: Dalian Univ Technol, State Key Lab Struct Anal Ind Equipment, Dalian 116024, Peoples R China Northwestern Univ, Dept Mech Engn, Evanston, IL 60208 USAHwang, K. C.论文数: 0 引用数: 0 h-index: 0机构: Tsinghua Univ, Dept Engn Mech, AML, Beijing 100084, Peoples R China Northwestern Univ, Dept Mech Engn, Evanston, IL 60208 USARogers, J. A.论文数: 0 引用数: 0 h-index: 0机构: Univ Illinois, Dept Mat Sci & Engn, Mat Res Lab, Urbana, IL 61801 USA Univ Illinois, Beckman Inst, Urbana, IL 61801 USA Northwestern Univ, Dept Mech Engn, Evanston, IL 60208 USA
- [49] Extending Networks from Chips to Flexible and Stretchable Electronics2016 TENTH IEEE/ACM INTERNATIONAL SYMPOSIUM ON NETWORKS-ON-CHIP (NOCS), 2016,Gupta, Ujjwal论文数: 0 引用数: 0 h-index: 0机构: Arizona State Univ, Sch Elect Comp & Energy Engn, Tempe, AZ 85287 USA Arizona State Univ, Sch Elect Comp & Energy Engn, Tempe, AZ 85287 USAOgras, Umit Y.论文数: 0 引用数: 0 h-index: 0机构: Arizona State Univ, Sch Elect Comp & Energy Engn, Tempe, AZ 85287 USA Arizona State Univ, Sch Elect Comp & Energy Engn, Tempe, AZ 85287 USA
- [50] Transfer printing techniques for flexible and stretchable inorganic electronicsNPJ FLEXIBLE ELECTRONICS, 2018, 2 (01)Linghu, Changhong论文数: 0 引用数: 0 h-index: 0机构: Zhejiang Univ, Dept Engn Mech, Soft Matter Res Ctr, Hangzhou 310027, Peoples R China Zhejiang Univ, Key Lab Soft Machines & Smart Devices Zhejiang Pr, Hangzhou 310027, Peoples R China Zhejiang Univ, Dept Engn Mech, Soft Matter Res Ctr, Hangzhou 310027, Peoples R ChinaZhang, Shun论文数: 0 引用数: 0 h-index: 0机构: Zhejiang Univ, Dept Engn Mech, Soft Matter Res Ctr, Hangzhou 310027, Peoples R China Zhejiang Univ, Key Lab Soft Machines & Smart Devices Zhejiang Pr, Hangzhou 310027, Peoples R China Zhejiang Univ, Dept Engn Mech, Soft Matter Res Ctr, Hangzhou 310027, Peoples R ChinaWang, Chengjun论文数: 0 引用数: 0 h-index: 0机构: Zhejiang Univ, Dept Engn Mech, Soft Matter Res Ctr, Hangzhou 310027, Peoples R China Zhejiang Univ, Key Lab Soft Machines & Smart Devices Zhejiang Pr, Hangzhou 310027, Peoples R China Zhejiang Univ, Dept Engn Mech, Soft Matter Res Ctr, Hangzhou 310027, Peoples R ChinaSong, Jizhou论文数: 0 引用数: 0 h-index: 0机构: Zhejiang Univ, Dept Engn Mech, Soft Matter Res Ctr, Hangzhou 310027, Peoples R China Zhejiang Univ, Key Lab Soft Machines & Smart Devices Zhejiang Pr, Hangzhou 310027, Peoples R China Zhejiang Univ, Dept Engn Mech, Soft Matter Res Ctr, Hangzhou 310027, Peoples R China