共 50 条
- [1] The design of new ultrasonic transducers for wire bonding devices ICEPT: 2007 8TH INTERNATIONAL CONFERENCE ON ELECTRONICS PACKAGING TECHNOLOGY, PROCEEDINGS, 2007, : 201 - +
- [2] Design of new ultrasonic transducers for wire bonding devices Journal of Shanghai Jiaotong University (Science), 2008, 13 (SUPPL.): : 36 - 38
- [3] New methodology for the design of advanced ultrasonic transducers for welding devices 2000 IEEE ULTRASONICS SYMPOSIUM PROCEEDINGS, VOLS 1 AND 2, 2000, : 699 - 704
- [4] Advanced bode plot techniques for ultrasonic transducers 43RD ANNUAL UIA SYMPOSIUM, 2015, 63 : 2 - 10
- [5] Impedance Modeling of Ultrasonic Transducers Used in Heavy Aluminum Wire Bonding IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2018, 8 (06): : 1107 - 1115