TECHNIQUES FOR CHARACTERIZATION OF TRANSDUCERS FOR ADVANCED ULTRASONIC NDE EQUIPMENT

被引:0
|
作者
BIRKS, AS
机构
关键词
D O I
暂无
中图分类号
TB3 [工程材料学];
学科分类号
0805 ; 080502 ;
摘要
引用
收藏
页码:A6 / A6
页数:1
相关论文
共 50 条
  • [1] ADVANCED NDE TECHNIQUES AND THEIR DEPLOYMENT ON HIGH PRESSURE EQUIPMENT
    Milligan, Jeffrey P.
    Peters, Daniel T.
    Van Velsor, Jason K.
    PROCEEDINGS OF THE ASME PRESSURE VESSELS AND PIPING CONFERENCE, PVP 2012, VOL 5: HIGH-PRESSURE TECHNOLOGY NONDESTRUCTIVE EVALUATION DIVISION, 2012, : 89 - 95
  • [2] CHARACTERIZATION OF NDE TRANSDUCERS
    TITTMANN, BR
    LAKIN, KM
    IEEE TRANSACTIONS ON SONICS AND ULTRASONICS, 1977, 24 (02): : 139 - 139
  • [3] Advanced bode plot techniques for ultrasonic transducers
    DeAngelis, D. A.
    Schulze, G. W.
    43RD ANNUAL UIA SYMPOSIUM, 2015, 63 : 2 - 10
  • [4] Advanced reflector characterization with ultrasonic phased arrays in NDE applications
    Wilcox, Paul D.
    Holmes, Caroline
    Drinkwater, Bruce W.
    IEEE TRANSACTIONS ON ULTRASONICS FERROELECTRICS AND FREQUENCY CONTROL, 2007, 54 (08) : 1541 - 1550
  • [5] New techniques for the design of advanced ultrasonic transducers for wire bonding
    Parrini, L
    IEEE TRANSACTIONS ON ELECTRONICS PACKAGING MANUFACTURING, 2003, 26 (01): : 37 - 45
  • [6] Applications of ultrasonic reflection mode conversion transducers in NDE
    Si-Chaib, MO
    Djelouah, H
    Bocquet, M
    NDT & E INTERNATIONAL, 2000, 33 (02) : 91 - 99
  • [7] RECENT DEVELOPMENT IN THE DESIGN OF PIEZOELECTRIC ULTRASONIC TRANSDUCERS FOR NDE
    HSU, NN
    FICK, SE
    PROCTOR, T
    MATERIALS EVALUATION, 1982, 40 (03) : A10 - A10
  • [8] CHARACTERIZATION OF ULTRASONIC TRANSDUCERS
    LAL, R
    DASGUPTA, DK
    IEEE TRANSACTIONS ON ELECTRICAL INSULATION, 1989, 24 (03): : 473 - 480
  • [9] CHARACTERIZATION OF NDE TRANSDUCERS AND SCATTERING SURFACES USING PHASE AND AMPLITUDE MEASUREMENTS OF ULTRASONIC-FIELD PATTERNS
    LAKIN, KM
    FEDOTOWSKY, A
    IEEE TRANSACTIONS ON SONICS AND ULTRASONICS, 1976, 23 (05): : 318 - 322
  • [10] Advanced process characterization for 125 kHz wire bonder ultrasonic transducers
    Parrini, L
    IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, 2002, 25 (03): : 486 - 494