A Case Study of High Temperature Pass Analysis Using Thermal Laser Stimulation Technique

被引:0
|
作者
Lin, Hung Sung [1 ]
Wu, Mong Sheng [1 ]
机构
[1] United Microelect Corp Ltd, Hsinchu 300, Taiwan
来源
2010 INTERNATIONAL RELIABILITY PHYSICS SYMPOSIUM | 2010年
关键词
temperature; TLS; NIR; thermal; laser;
D O I
10.1109/IRPS.2010.5488717
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
The intrinsic carrier concentration n(i) is highly temperature dependent in non-degenerate semiconductors. At high temperatures, thermally generated electron-hole pairs contribute to the carrier concentrations. As a result, the generation of free carriers can be achieved through light-to-heat conversion using near-infrared (NIR) laser. This paper describes the use of the thermal laser stimulation (TLS) technique to modify the electrical properties of a heated passive device so that the direct failure location can be revealed in order to clarify the cause of the iddq leakage that will disappear during high temperature tests.
引用
收藏
页码:870 / 873
页数:4
相关论文
共 50 条
  • [31] Study of stability of high-temperature polyimides using TG/MS technique
    Xie, W
    Heltsley, R
    Cai, XH
    Deng, FQ
    Liu, JM
    Lee, C
    Pan, WP
    JOURNAL OF APPLIED POLYMER SCIENCE, 2002, 83 (06) : 1219 - 1227
  • [32] Study on temperature measurement of gas flow with high temperature and speed using thermal video system
    Zhu, DZ
    Liao, L
    Gu, YQ
    OPTICAL DIAGNOSTICS FOR FLUIDS/HEAT/COMBUSTION AND PHOTOMECHANICS FOR SOLIDS, 1999, 3783 : 373 - 379
  • [33] Measurement of Thermal Expansion at High Temperature by a Transient Interferometric Technique
    P. Reiter
    E. Kaschnitz
    International Journal of Thermophysics, 2002, 23 : 1327 - 1338
  • [34] THEORETICAL APPROACH TO A TECHNIQUE FOR MEASURING THERMAL CONDUCTIVITY AT HIGH TEMPERATURE
    VARDI, J
    LEMLICH, R
    JOURNAL OF APPLIED PHYSICS, 1970, 41 (06) : 2439 - &
  • [36] Measurement of thermal expansion at high temperature by a transient interferometric technique
    Reiter, P
    Kaschnitz, E
    INTERNATIONAL JOURNAL OF THERMOPHYSICS, 2002, 23 (05) : 1327 - 1338
  • [37] A study on separating of a silicon wafer with moving laser beam by using thermal stress cleaving technique
    Saman, Alias Mohd
    Furumoto, Tatsuaki
    Ueda, Takashi
    Hosokawa, Akira
    JOURNAL OF MATERIALS PROCESSING TECHNOLOGY, 2015, 223 : 252 - 261
  • [38] Optimal Design of High Temperature Vacuum Furnace Using Thermal Analysis Database
    Li, Zhen-Zhe
    Park, Mee-Young
    Lee, Jae-Woo
    Byun, Yung-Hwan
    Lee, Changjin
    TRANSACTIONS OF THE KOREAN SOCIETY OF MECHANICAL ENGINEERS B, 2006, 30 (06) : 594 - 601
  • [39] Nanoscale Fabrication Using Thermal Lithography Technique With Blue Laser
    Liu, Chung Ping
    Huang, Yao Xian
    Hsu, Che Chuan
    Jeng, Tsun Ren
    Chen, Jung Po
    IEEE TRANSACTIONS ON MAGNETICS, 2009, 45 (05) : 2206 - 2208
  • [40] Technique for thermal lens measuring using the Gerchberg-Saxton algorithm in high power laser systems
    Burkov, A. S.
    Tereshchenko, N., V
    Larionov, I. A.
    Obronov, I., V
    Myasnikov, D., V
    JOURNAL OF THE OPTICAL SOCIETY OF AMERICA B-OPTICAL PHYSICS, 2024, 41 (03) : 637 - 643