Experimental determination of the correlation between conductivity and mechanical stress of a silver-filled electrically conductive adhesive

被引：0

作者：

Bornemann, J ^{[1
]}

Schlimmer, M ^{[1
]}

机构：

[1] Univ Gesamthsch Kassel, Inst Werkstofftech, D-34125 Kassel, Germany

来源：

MICRO MATERIALS, PROCEEDINGS | 2000年

关键词：

D O I：

暂无

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

引用

页码：1048 / 1051

页数：4

共 35 条

[11] Dynamic fatigue and failure behavior of silver-filled electronically conductive adhesive joints at ambient environmental conditions
Sancaktar, E. (erol@uakron.edu), 1600, VSP BV (18):
[12] Dynamic fatigue and failure behavior of silver-filled electronically conductive adhesive joints at ambient environmental conditions
Gomatam, RR
Sancaktar, E
JOURNAL OF ADHESION SCIENCE AND TECHNOLOGY, 2004, 18 (07) : 731 - 750
[13] Fatigue and failure behaviors of silver-filled electronically-conductive adhesive joints subjected to elevated humidity
Gomatam, Rajesh R.
Sancaktar, Erol
Journal of Adhesion Science and Technology, 2004, 18 (15-16): : 1833 - 1848
[14] Fatigue and failure behavior of silver-filled electronically-conductive adhesive joints subjected to elevated temperatures
Gomatam, RR
Sancaktar, E
JOURNAL OF ADHESION SCIENCE AND TECHNOLOGY, 2004, 18 (08) : 849 - 881
[15] Fatigue and failure behavior of silver-filled electronically-conductive adhesive joints subjected to elevated temperatures
Gomatam, R., 1600, Taylor and Francis Ltd. (18):
[16] Fatigue and failure behaviors of silver-filled electronically-conductive adhesive joints subjected to elevated humidity
Gomatam, RR
Sancaktar, E
JOURNAL OF ADHESION SCIENCE AND TECHNOLOGY, 2004, 18 (15-16) : 1833 - 1848
[17] Effects of various adherend surface treatments on fatigue behavior of joints bonded with a silver-filled electronically conductive adhesive
Gomatam, RR
Sancaktar, E
JOURNAL OF ADHESION SCIENCE AND TECHNOLOGY, 2005, 19 (08) : 659 - 678
[18] Copper Filled Polyurethane Based Electrically Conductive Adhesive with Improved Mechanical Strength
Ho, Li-Ngee
Nishikawa, Hiroshi
2013 EUROPEAN MICROELECTRONICS PACKAGING CONFERENCE (EMPC), 2013,
[19] Electrically conductive adhesive based on acrylate resin filled with silver plating graphite nanosheet
Zhang, Yi
Qi, Shuhua
Wu, Xinming
Duan, Guochen
SYNTHETIC METALS, 2011, 161 (5-6) : 516 - 522
[20] Effects of various adherend surface treatments on fatigue behavior of joints bonded with a silver-filled electronically conductive adhesive
Sancaktar, E. (erol@uakron.edu), 1600, VSP BV (19):

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