Tack behaviours of p-t-octylphenol formaldehyde resin with rubber using a molecular simulation

被引:9
|
作者
Choi, SS
Jang, JH
机构
[1] Kumho Res & Dev Ctr, Kwangsan Gu, Kwangju 506040, South Korea
[2] Kumho Chem Labs, Taejon 305600, South Korea
关键词
tack; molecular simulation; interaction;
D O I
10.1016/S0032-3861(97)10391-3
中图分类号
O63 [高分子化学(高聚物)];
学科分类号
070305 ; 080501 ; 081704 ;
摘要
Tack behaviours of p-t-octylphenol formaldehyde resin with rubbers, such as cis-l,4-polyisoprene and cis-1,4-polybutadiene, were studied using molecular mechanics and dynamics. The structures of p-t-octylphenol formaldehyde resin were found to be that hydroxyl groups cluster in the centre of the molecule by intramolecular hydrogen bondings and the t-octyl groups are extended out. The tack of p-t-octylphenol formaldehyde resin with rubber is formed by intermolecular non-bond interactions between the t-octyl groups of the resin and rubber chains. The interaction energies between one p-t-octylphenol formaldehyde resin molecule and two rubber molecules were calculated to investigate the effect of the molecular size of the resin on the tack strength. The interaction energies for the dimer and the trimer of p-t-octylphenol formaldehyde resin are greater than - 20 kcal/mol while those for the tetramer-decamer are less than - 40 kcal/mol. (C) 1998 Elsevier Science Ltd. All rights reserved.
引用
收藏
页码:5861 / 5866
页数:6
相关论文
共 50 条
  • [21] Simulation of pyrolysis of crosslinked epoxy resin using ReaxFF molecular dynamics
    Li, Guo
    Hu, Peng
    Luo, Wen
    Zhang, Jianzhu
    Yu, Huahua
    Chen, Faliang
    Zhang, Feizhou
    COMPUTATIONAL AND THEORETICAL CHEMISTRY, 2021, 1200
  • [22] Photostabilization of wood using low molecular weight phenol formaldehyde resin and hindered amine light stabilizer
    Evans, Philip D.
    Gibson, Sara Kraushaar
    Cullis, Ian
    Liu, Chunling
    Sebe, Gilles
    POLYMER DEGRADATION AND STABILITY, 2013, 98 (01) : 158 - 168
  • [23] The thermal characteristics of epoxy resin: Design and predict by using molecular simulation method
    Yang, Qing
    Li, Xiudi
    Shi, Lei
    Yang, Xiaoping
    Sui, Gang
    POLYMER, 2013, 54 (23) : 6447 - 6454
  • [24] Investigation of the adhesion and debonding behaviors of rubber asphalt and aggregates using molecular dynamics simulation
    Guo, Fucheng
    Pei, Jianzhong
    Huang, Guojing
    Zhang, Jiupeng
    Falchetto, Augusto Cannone
    Korkiala-Tanttu, Leena
    CONSTRUCTION AND BUILDING MATERIALS, 2023, 371
  • [25] Simulation of Compound bulging process for T-branch tubes using rubber medium
    Chen, Zhizhong
    Lu, Bin
    MACHINERY, MATERIALS SCIENCE AND ENGINEERING APPLICATIONS, PTS 1 AND 2, 2011, 228-229 : 88 - 95
  • [26] Experimental and molecular dynamics simulation study on the damping mechanism of C5 petroleum resin/chlorinated butyl rubber composites
    Yin, Chao
    Zhao, Xiuying
    Zhu, Jing
    Hu, Haihua
    Song, Meng
    Wu, Sizhu
    JOURNAL OF MATERIALS SCIENCE, 2019, 54 (05) : 3960 - 3974
  • [27] Experimental and molecular dynamics simulation study on the damping mechanism of C5 petroleum resin/chlorinated butyl rubber composites
    Chao Yin
    Xiuying Zhao
    Jing Zhu
    Haihua Hu
    Meng Song
    Sizhu Wu
    Journal of Materials Science, 2019, 54 : 3960 - 3974
  • [28] A Moisture Absorption and Adhesion Study of the Process of Blending Film Using p-Alkylphenol-Resorcinol-Formaldehyde and Rubber Latex
    Shen, Mingxia
    Zhang, Junsheng
    Chen, Qingmin
    JOURNAL OF APPLIED POLYMER SCIENCE, 2009, 113 (06) : 3550 - 3556
  • [29] Efficient transformation of corn stover to furfural using p-hydroxybenzenesulfonic acid-formaldehyde resin solid acid
    Zhang, Tingwei
    Li, Wenzhi
    An, Shengxin
    Huang, Feng
    Li, Xinzhe
    Liu, Jingrong
    Pei, Gang
    Liu, Qiying
    BIORESOURCE TECHNOLOGY, 2018, 264 : 261 - 267
  • [30] Temperature based adsorption studies of Cr(VI) using p-toluidine formaldehyde resin coated silica material
    Dinker, Manish Kumar
    Kulkarni, Prashant Shripad
    NEW JOURNAL OF CHEMISTRY, 2015, 39 (05) : 3687 - 3697