Backside passivation for improving the noise performance in CMOS image sensor

被引:1
|
作者
Sun, Peng [1 ,2 ]
Hu, Sheng [2 ]
Zou, Wen [2 ]
Wang, Peng-Fei [1 ]
Chen, Lin [1 ]
Zhu, Hao [1 ]
Sun, Qing-Qing [1 ]
Zhang, David Wei [1 ]
机构
[1] Fudan Univ, Dept Microelect, State Key Lab ASIC & Syst, Shanghai 200433, Peoples R China
[2] Wuhan Xinxin Semicond Mfg Co Ltd, Wuhan 430205, Peoples R China
关键词
Image enhancement - MOS devices - Passivation - Dielectric devices - Metallic compounds - Transistors - Oxide semiconductors - Image sensors - Pixels - Charge coupled devices - CMOS integrated circuits - Silica;
D O I
10.1063/5.0006700
中图分类号
TB3 [工程材料学];
学科分类号
0805 ; 080502 ;
摘要
Great efforts have been made in the past few years to reduce the white pixel noise in complementary metal-oxide-semiconductor (CMOS) image sensors. As a promising approach, the surface passivation method focusing on the field-effect passivation has been studied in this work. Based on the metal-oxide-semiconductor capacitor device model, electrical measurement and analysis have been performed for characterizing the charge distribution in the system. The relationship between the flat band voltage and the white pixel performance has been set up, and the proposed passivation method that controls Si or SiO2 interface charge or traps has been proved effective in lowering the white pixel noise, which can be very attractive in improving the performance of CMOS image sensors for high-resolution and high-sensitivity applications.
引用
下载
收藏
页数:5
相关论文
共 50 条
  • [31] Reduction of CMOS Image Sensor Read Noise to Enable Photon Counting
    Guidash, Michael
    Ma, Jiaju
    Vogelsang, Thomas
    Endsley, Jay
    SENSORS, 2016, 16 (04):
  • [32] A low noise CMOS image sensor with an emission filter for fluorescence applications
    Beiderman, Marianna
    Tam, Terence
    Fish, Alexander
    Jullien, Graham. A.
    Yadid-Pecht, Orly
    PROCEEDINGS OF 2008 IEEE INTERNATIONAL SYMPOSIUM ON CIRCUITS AND SYSTEMS, VOLS 1-10, 2008, : 1100 - 1103
  • [33] Noise reflection for IBIS5-A-1300 CMOS image sensor
    Xi'an Institute of Optics and Precision Mechanies, Chinese Academy of Sciences, Xi'an 710119, China
    不详
    Guangzi Xuebao/Acta Photonica Sinica, 2008, 37 (12): : 2576 - 2579
  • [34] Analysis of the output noise voltage in CMOS image sensor readout circuit
    Yoon, Youngchang
    Lee, Hochul
    Park, Byung-Gook
    Lee, Jong Duk
    Shin, Hyungcheol
    2006 IEEE INTERNATIONAL CONFERENCE ON SEMICONDUCTOR ELECTRONICS, PROCEEDINGS, 2006, : 944 - +
  • [35] Human perception of fixed pattern noise in pyramidal CMOS image sensor
    Saffih, F
    Hornsey, RI
    Wilson, HR
    PHOTONICS NORTH: APPLICATIONS OF PHOTONIC TECHNOLOGY 7B, PTS 1 AND 2: CLOSING THE GAP BETWEEN THEORY, DEVELOPMENT, AND APPLICATION - PHOTONIC APPLICATIONS IN ASTRONOMY, BIOMEDICINE, IMAGING, MATERIALS PROCESSING, AND EDUCATION, 2004, 5578 : 400 - 409
  • [36] Implementation of Low Noise Photodiode Active Pixel for CMOS image Sensor
    Maity, Niladri Pratap
    FUTURE INFORMATION TECHNOLOGY, 2011, 13 : 124 - 128
  • [37] Displacement Damage Effects in Backside Illuminated CMOS Image Sensors
    Liu, Bingkai
    Li, Yudong
    Wen, Lin
    Zhao, Jinghao
    Zhou, Dong
    Feng, Jie
    Guo, Qi
    IEEE TRANSACTIONS ON ELECTRON DEVICES, 2022, 69 (06) : 2907 - 2914
  • [38] Enhanced Charge Transfer Efficiency Using Ring Vertical Transfer Gates in Backside Illuminated CMOS Image Sensor
    Lee, Yu-Chieh
    Das, Avishek
    Huang, Yi
    Venkatesapandian, Logeshwaran
    Liu, C. W.
    2024 INTERNATIONAL VLSI SYMPOSIUM ON TECHNOLOGY, SYSTEMS AND APPLICATIONS, VLSI TSA, 2024,
  • [39] Backside illuminated CMOS image sensors optimized by modeling and simulation
    Minoglou, K.
    Rao, Padmakumar R.
    Rahman, M.
    De Munck, K.
    Van Hoof, C.
    De Moor, P.
    OPTICAL AND QUANTUM ELECTRONICS, 2011, 42 (11-13) : 691 - 698
  • [40] A high-performance and low-noise CMOS image sensor with an expanding photodiode under the isolation oxide
    Itonaga, K
    Abe, H
    Yoshihara, T
    Hirayama, T
    IEEE INTERNATIONAL ELECTRON DEVICES MEETING 2005, TECHNICAL DIGEST, 2005, : 809 - 812