Profile simulation of SU-8 thick film resist

被引:16
|
作者
Sensu, Y [1 ]
Sekiguchi, A [1 ]
Mori, S [1 ]
Honda, N [1 ]
机构
[1] Litho Tech Japan Corp, Kawaguchi, Saitama 3320034, Japan
来源
Advances in Resist Technology and Processing XXII, Pt 1 and 2 | 2005年 / 5753卷
关键词
chemically amplified negative resist; thick-film resist; cross-link; PEB; resolution; lithography simulation;
D O I
10.1117/12.596856
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
XP SU-8 3000 (hereinafter referred to as "SU-8") thick-film resist is a chemically amplified negative resist based on epoxy resin. Here, we report on the profile simulation for this resist. Profile simulation is an important technique for planning experiments. Thus, there have been many reports on simulation techniques. In particular, many studies have been conducted on chemically amplified positive resists, as they are major resist materials used in the IC industry. However, there have been few simulation studies concerning chemically amplified negative resists. Under these circumstances, we have considered performing simulations on chemically amplified negative resist. The results of the simulation and the SEM observations are in good agreement. This study demonstrates that simulation is possible for a chemically amplified negative resist (SU-8).
引用
收藏
页码:1170 / 1185
页数:16
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