SUSCEPTIBILITY TO DEEP PROCESSING IN THE WIRE DRAWING PROCESS OF ETP AND OF GRADE COPPER

被引：0

作者：

Smyrak, B. ^{[1
]}

Zasadzinska, M. ^{[1
]}

Knych, T. ^{[1
]}

Mamala, A. ^{[1
]}

Kawecki, A. ^{[1
]}

Walkowicz, M. ^{[1
]}

Strzepek, P. ^{[1
]}

机构：

[1] AGH Univ Sci & Technol, Fac Nonferrous Met, Krakow, Poland

来源：

METALURGIJA | 2022年 / 61卷 / 3-4期

关键词：

Cu-ETP and Cu-OF; copper wire drawing; mechanical properties; electrical properties; softening curves; OXYGEN-CONTENT; RECRYSTALLIZATION; DEFORMATION; BEHAVIOR;

D O I：

暂无

中图分类号：

TF [冶金工业];

学科分类号：

0806 ;

摘要：

The susceptibility to deep processing in the industrial wire drawing process has been investigated in the research paper regarding the copper grade influence on the process. The conducted research included the identification of the mechanical and electrical properties of wires manufactured from Electrolytic Tough Pitch Copper (Cu-ETP) wire rod and Oxygen-Free Copper (Cu-OF) cast rod in terms of the applied deformation. In particular, as main contribution of this research to the scientific and industrial community a mathematical model describing the wire strengthening and softening characteristics was determined.

引用

页码：749 / 752

页数：4

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