Compensation of EUV lithography mask blank defect based on an advanced genetic algorithm

被引:12
|
作者
Wu, Ruixuan [1 ,2 ]
Dong, Lisong [1 ,2 ,3 ]
Ma, Xu [4 ]
Wei, Yayi [1 ,2 ,3 ]
机构
[1] Chinese Acad Sci, Inst Microelect, Beijing 100029, Peoples R China
[2] Univ Chinese Acad Sci, Beijing 100049, Peoples R China
[3] Guangdong Greater Bay Area Appl Res Inst Integrat, Guangzhou 510700, Peoples R China
[4] Beijing Inst Technol, Sch Opt & Photon, Minist Educ China, Key Lab Photoelect Imaging Technol & Syst, Beijing 100081, Peoples R China
基金
中国国家自然科学基金;
关键词
13;
D O I
10.1364/OE.434787
中图分类号
O43 [光学];
学科分类号
070207 ; 0803 ;
摘要
Mask blank defect is one of the most important factors that degrades the image quality of extreme ultraviolet (EUV) lithography system, and further leads to a yield lose. In order to compensate the amplitude and phase distortions caused by the EUV mask blank defects, this paper proposes an advanced algorithm to optimize the mask absorber pattern based on genetic algorithm. First, a successive approximation correction method is used to roughly compensate the effect of mask blank defect. Then, an advanced genetic algorithm is proposed to obtain higher efficiency and compensation accuracy, which uses an adaptive coding strategy and a fitness function considering normalized image log slope of lithography image. For illustration, the proposed method is verified based on rectangular contact patterns and complex pattern with different defects. The aerial images of optimized masks are evaluated by a commercial lithography simulator. It will show that the proposed method can mitigate the impact of mask defects, and improve the fidelity of lithography print image. The simulation results also demonstrate the higher convergence efficiency and mask manufacturability can be guaranteed by the proposed method. (C) 2021 Optical Society of America under the terms of the OSA Open Access Publishing Agreement
引用
收藏
页码:28872 / 28885
页数:14
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