Thermocouple lag in transient heat-shield measurements due to thermal mass difference

被引：1
|
作者：
Hobson, DD
机构：
[1] Lincoln Laboratory, Massachusetts Institute of Technology, Lexington, MA
来源：
JOURNAL OF HEAT TRANSFER-TRANSACTIONS OF THE ASME | 1996年 / 118卷 / 04期
关键词：
instrumentation; measurement techniques; transient and unsteady heat transfer;
D O I：
10.1115/1.2822578
中图分类号：
O414.1 [热力学];
学科分类号：
摘要：
[No abstract available]
引用
收藏
页码：838 / 841
页数：4
相关论文
共 50 条
  • [41] TRANSIENT THERMAL-STRESSES IN A COMPOSITE CIRCULAR-CYLINDER DUE TO A BAND HEAT SOURCE
    TAKEUTI, Y
    NODA, N
    NUCLEAR ENGINEERING AND DESIGN, 1978, 48 (2-3) : 427 - 436
  • [42] TRANSIENT THERMAL-STRESSES IN A RECTANGULAR PLATE DUE TO NONUNIFORM HEAT-TRANSFER COEFFICIENTS
    CHEN, PYP
    JOURNAL OF THERMAL STRESSES, 1988, 11 (02) : 115 - 125
  • [43] TRANSIENT THERMAL-STRESSES IN A CONNECTED RECTANGULAR SOLID DUE TO HEAT-GENERATION ON THE INTERFACE
    ISHIDA, R
    BULLETIN OF THE JSME-JAPAN SOCIETY OF MECHANICAL ENGINEERS, 1986, 29 (258): : 4456 - 4456
  • [44] Inferring the thermal resistance and effective thermal mass of a wall using frequent temperature and heat flux measurements
    Biddulph, Phillip
    Gori, Virginia
    Elwell, Clifford A.
    Scott, Cameron
    Rye, Caroline
    Lowe, Robert
    Oreszczyn, Tadj
    ENERGY AND BUILDINGS, 2014, 78 : 10 - 16
  • [45] Simultaneous measurements of the specific heat and thermal conductivity of suspended thin samples by transient electrothermal method
    Feng, Bo
    Ma, Weigang
    Li, Zhixin
    Zhang, Xing
    REVIEW OF SCIENTIFIC INSTRUMENTS, 2009, 80 (06):
  • [46] Measurements of Effective Thermal Conductivity of Azuki Beans by Transient Heat Flow Method Using a Probe
    Tagawa, A.
    Murata, S.
    Hinosawa, H.
    Nippon Shokuhan Kogyo Gakkaishi/Journal of Japanese Society of Food Science and Technology, 42 (02):
  • [47] RADIATIVE HEAT-TRANSFER IN TRANSIENT HOT-WIRE MEASUREMENTS OF THERMAL-CONDUCTIVITY
    DECASTRO, CAN
    PERKINS, RA
    RODER, HM
    INTERNATIONAL JOURNAL OF THERMOPHYSICS, 1991, 12 (06) : 985 - 997
  • [48] A methodology for the generation of dynamic compact models of packages and heat sinks from thermal transient measurements
    Rencz, M
    Farkas, G
    Poppe, A
    Székely, V
    Courtois, B
    IEEE/CPMT/SEMI(R) 28TH INTERNATIONAL ELECTRONICS MANUFACTURING TECHNOLOGY SYMPOSIUM, 2003, : 117 - 123
  • [49] Coupling effects of dual-phase-lag heat conduction and property difference on thermal shock fracture of coating/substrate structures
    Guo, S. L.
    Wang, B. L.
    Wang, K. F.
    Li, J. E.
    INTERNATIONAL JOURNAL OF SOLIDS AND STRUCTURES, 2018, 152 : 238 - 247
  • [50] Thermal Attenuation and Lag Time in Fractured Rock: Theory and Field Measurements From Joint Heat and Solute Tracer Tests
    de La Bernardie, J.
    Bour, O.
    Le Borgne, T.
    Guiheneuf, N.
    Chatton, E.
    Labasque, T.
    Le Lay, H.
    Gerard, M. -F.
    WATER RESOURCES RESEARCH, 2018, 54 (12) : 10053 - 10075
12345