Shielding design optimizing EMC characteristics in advanced MCM packaging

MCM packaging is greatly influenced by specific applications for which each device has been developed. Less emphasis is putted on the optimisation of packaging characteristics with respect to electromagnetic interference and compatibility. The existing technology and design tools do not take deeply into account these class of problems. Especially new generations of microelectronics sensors requires dedicated strategies to optimise the internal design and packaging process in order to reach a compromise between performance and costs. In the past this problem has been addressed with more qualitative solutions as those proposing modular structures to define suitable techniques able to give better result then those adopting one-block structure. Now a more theoretical approach leads to define a new set of rules able to overcome the problem with a good internal design and a dedicated package. Specific considerations are made and comments on future developments complete the presentation on EMC demands.