Imaging the Polymorphic Transformation in a Single Cu6Sn5 Grain in a Solder Joint

In-situ observations of the polymorphic transformation in a single targeted Cu6Sn5 grain constrained between Sn-0.7 wt % Cu solder and Cu-Cu3Sn phases and the associated structural evolution during a solid-state thermal cycle were achieved via a high-voltage transmission electron microscope (HV-TEM) technique. Here, we show that the monoclinic eta'-Cu6Sn5 superlattice reflections appear in the hexagonal eta'-Cu6Sn5 diffraction pattern upon cooling to isothermal 140 degrees C from 210 degrees C. The in-situ real space imaging shows that the eta'-Cu6Sn5 contrast pattern is initiated at the grain boundary. This method demonstrates a new approach for further understanding the polymorphic transformation behavior on a real solder joint.