Virtual thermo-mechanical prototyping of electronic packaging - the bottlenecks and solutions for damage modeling

被引：3
|
作者：
Zhang, GQ [1 ]
Tay, AAO [1 ]
Ernst, LJ [1 ]
机构：
[1] Philips, CFT, NL-5600 MD Eindhoven, Netherlands
来源：
PROCEEDINGS OF 3RD ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE | 2000年
关键词：
D O I：
10.1109/EPTC.2000.906384
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
This paper presents the strategy and methodology for virtual thermo-mechanical prototyping of electronic packages specified by Philips. The focus is on the bottlenecks and solutions for damage modeling in virtual thermo-mechanical prototyping. It demonstrates that the capability to understand and develop reliable damage models and criteria in both macro and micro levels is vital for virtual thermo-mechanical prototyping. As the conclusion, by combining the strengths of reliable simulation models with advanced optimization strategy, virtual prototyping can be used in packaging development to achieve more business profitability.
引用
收藏
页码：263 / 269
页数：7
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