Conductivity enhancement of polymer composites using high temperature short-time treated silver fillers

被引:38
|
作者
Li, Chaowei [1 ,2 ]
Li, Qiulong [2 ]
Cheng, Liyao [3 ]
Li, Taotao [2 ]
Lu, Huifen [2 ]
Tang, Lei [2 ]
Zhang, Kai [2 ]
Songfeng, E. [1 ,2 ]
Zhang, Jun [2 ]
Li, Zhuo [4 ]
Yao, Yagang [1 ,2 ]
机构
[1] Univ Sci & Technol China, Sch Nano Technol & Nano Bion, Hefei 230026, Anhui, Peoples R China
[2] Univ Chinese Acad Sci, Div Adv Nanomat, Key Lab Nanodevices & Applicat, CAS Ctr Excellence Nanosci,Suzhou Inst Nanotech &, Suzhou 215123, Peoples R China
[3] Hunan Normal Univ, High Sch, Class 1460, Grade 2014, Changsha 410006, Hunan, Peoples R China
[4] Fudan Univ, Dept Mat Sci, Shanghai 200433, Peoples R China
基金
中国国家自然科学基金;
关键词
High-temperature short-time annealing method; Electrically conductive adhesives (ECAs); Low electrical resistivity; THERMAL-DECOMPOSITION; HOLLOW SPHERES; ADHESIVES; IMPROVEMENT; FLAKES; GREEN;
D O I
10.1016/j.compositesa.2017.05.007
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
In this work, we develop an easy, convenient and effective high-temperature short-time annealing method to treat silver fillers through decomposing the silver oxide on the surface into silver nanoparticles and also in-situ paralyzing part of the surface lubricants to reduce the length of the tunneling distance between neighboring silver flakes. The modified micro silver flakes play a significant role in improving the electrical conductivity of the corresponding electrically conductive adhesives (ECAs), exhibiting the lowest resistivity of 1.28 x 10(-4) Omega cm at 70 wt% filler loading. This work suggests that the high temperature short-time annealing strategy can greatly enhance the electrical conductivity of as treated silver flakes based ECAs, which will allow them to be widely used in electronic packaging. (C) 2017 Elsevier Ltd. All rights reserved.
引用
收藏
页码:64 / 70
页数:7
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