Module/packaging technologies for optical components: Current and future trends

被引：4

作者：

Kobayashi, M ^{[1
]}

Dutta, AK ^{[1
]}

机构：

[1] Fujitsu Quantum Devices Ltd, Yamanashi 4093883, Japan

来源：

ACTIVE AND PASSIVE OPTICAL COMPONENTS FOR WDM COMMUNICATION | 2001年 / 4532卷

关键词：

packaging/module technology; optical components; integration; hybrid; monolithic; surface mount; planar lightwave circuit (PLC);

D O I：

10.1117/12.436020

中图分类号：

TP18 [人工智能理论];

学科分类号：

081104 ; 0812 ; 0835 ; 1405 ;

摘要：

The basic design methodology and criteria required for packaging of optical components are reviewed, and the state-of-art of different types of the packaging technologies of laser modules and receiver modules are addressed. They are Mini-DEL DFB-LD module, wavelength-locker integrated laser module, 10 Gbps receiver module with integrated APD and preamplifier IC, and non-hermetic SMT module. Considerations on future packaging technologies and integrated optical components are also discussed.

引用

下载

页码：270 / 280

页数：11

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