Module/packaging technologies for optical components: Current and future trends

The basic design methodology and criteria required for packaging of optical components are reviewed, and the state-of-art of different types of the packaging technologies of laser modules and receiver modules are addressed. They are Mini-DEL DFB-LD module, wavelength-locker integrated laser module, 10 Gbps receiver module with integrated APD and preamplifier IC, and non-hermetic SMT module. Considerations on future packaging technologies and integrated optical components are also discussed.