Chromatography of bis-(3-sulfopropyl) disulfide and its breakdown products by HPLC coupled with electrochemical detection

被引:7
|
作者
Volov, Igor [1 ]
Mann, Olivier [2 ]
Hoenersch, Yvonne [2 ]
Wahl, Bjoern [2 ]
West, Alan C. [1 ]
机构
[1] Columbia Univ, Dept Chem Engn, New York, NY 10024 USA
[2] Atotech Deutschland GmbH, Berlin, Germany
关键词
Bis-(3-sulfopropyl) disulfide; Copper; Electrodeposition; HPLC; 3-Mercaptopropyl sulfonate; COPPER ELECTROPLATING BATH; ELECTRODEPOSITION; ADDITIVES; SPS; CHEMISTRY; ACID; DECOMPOSITION; BRIGHTENER; CHLORIDE;
D O I
10.1002/jssc.201100352
中图分类号
O65 [分析化学];
学科分类号
070302 ; 081704 ;
摘要
A chromatographic method for the detection of bis-(3-sulfopropyl) disulfide (SPS), a common additive in acidic copper plating baths, and its breakdown products is demonstrated. The detection scheme involves a combination of solid-phase extraction for sample pre-treatment, C-18 reversed-phase high-performance liquid chromatography column for separation, and electrochemical sensor for detection of all non-fully oxidized sulfur-containing compounds. We were able to achieve an effective separation and accurately assign chromatographic peaks to all detectable species. Owing to a high sensitivity of the utilized electrochemical detector, detection in low parts per billion range was possible. This can prove crucial for plating bath control, since minute amounts of certain by-products significantly affect the bath performance.
引用
收藏
页码:2385 / 2390
页数:6
相关论文
共 50 条
  • [1] Trace bis-(3-sulfopropyl)-disulfide enhanced electrodeposited copper foils
    Lingling Liu
    Yeqiang Bu
    Yue Sun
    Jianfeng Pan
    Jiabin Liu
    Jien Ma
    Lin Qiu
    Youtong Fang
    Journal of Materials Science & Technology, 2021, 74 (15) : 237 - 245
  • [2] Trace bis-(3-sulfopropyl)-disulfide enhanced electrodeposited copper foils
    Liu, Lingling
    Bu, Yeqiang
    Sun, Yue
    Pan, Jianfeng
    Liu, Jiabin
    Ma, Jien
    Qiu, Lin
    Fang, Youtong
    JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY, 2021, 74 : 237 - 245
  • [3] Effect of Bis-(3-sulfopropyl) Disulfide and Chloride Ions on the Localized Electrochemical Deposition of Copper Microstructures
    Wang, Fuliang
    Li, Yijie
    He, Hu
    Wang, Yan
    Zhu, Wenhui
    Li, Jianping
    JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 2017, 164 (07) : D419 - D424
  • [4] Synergistic effect of ethylene thiourea and bis-(3-sulfopropyl)-disulfide on acid cu Electrodeposition
    Zhang, Wei
    Lu, Xinchun
    Liu, Yuhong
    Luo, Jianbin
    JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 2007, 154 (10) : D526 - D529
  • [5] Adsorption and Desorption of Bis-(3-sulfopropyl) Disulfide during Cu Electrodeposition and Stripping at Au Electrodes
    Chiu, Yong-Da
    Dow, Wei-Ping
    Krug, Klaus
    Liu, Yung-Fang
    Lee, Yuh-Lang
    Yau, Shueh-Lin
    LANGMUIR, 2012, 28 (40) : 14476 - 14487
  • [6] Bottom-up filling in Cu electroless deposition using bis-(3-sulfopropyl)-disulfide (SPS)
    Lee, CH
    Lee, SC
    Kim, JJ
    ELECTROCHIMICA ACTA, 2005, 50 (16-17) : 3563 - 3568
  • [7] Degradation of Bis(3-sulfopropyl) Disulfide and Its Influence on Copper Electrodeposition for Feature Filling
    Choe, Seunghoe
    Kim, Myung Jun
    Kim, Hoe Chul
    Cho, Sung Ki
    Ahn, Sang Hyun
    Kim, Soo-Kil
    Kim, Jae Jeong
    JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 2013, 160 (12) : D3179 - D3185
  • [8] Bis-(3-sulfopropyl) Disulfide Acceleration of Copper Electrodeposition via Molecular Dynamics and Quantum Chemical Calculations
    Wang, Fuliang
    Le, Yuping
    INTERNATIONAL JOURNAL OF ELECTROCHEMICAL SCIENCE, 2020, 15 (06): : 4931 - 4943
  • [9] Electrodeposition of Cu from acidic sulfate solutions in the presence of bis-(3-sulfopropyl)-disulfide (SPS) and chloride ions
    Bozzini, B
    D'Urzo, L
    Romanello, V
    Mele, C
    JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 2006, 153 (04) : C254 - C257
  • [10] Superconformal Cu electrodeposition using DPS a substitutive accelerator for bis(3-sulfopropyl) disulfide
    Cho, SK
    Kim, SK
    Kim, JJ
    JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 2005, 152 (05) : C330 - C333