Improvement of Nanotwinned Copper Thermal Stability for High Temperature Heterogeneous Integration

被引：1

作者：

Chiu, Wei-Lan ^{[1
]}

Hung, Ying Tzu ^{[1
]}

Lee, Ou-Hsiang ^{[1
]}

Ou-Yang, Tsung Yu ^{[1
]}

Chang, Hsiang-Hung ^{[1
]}

Lo, Wei-Chung ^{[1
]}

机构：

[1] Ind Technol Res Inst ITRI, Elect & Optoelect Syst Res Labs, Hsinchu, Taiwan

来源：

2021 INTERNATIONAL SYMPOSIUM ON VLSI TECHNOLOGY, SYSTEMS AND APPLICATIONS (VLSI-TSA) | 2021年

关键词：

D O I：

10.1109/VLSI-TSA51926.2021.9440121

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

The novel nanotwinned copper material was investigated for use as an interconnect material for microelectronic packaging. It provides improved electro-migration and mechanical reliabilities versus traditional Cu interconnects. By adding low level impurities, nt-Cu can be stabilized for a thermal budget of 400 degrees C for 1h annealing. This technology is promising for high temperature heterogeneous integration.

引用

页数：2

共 50 条

[41] High Thermal Stability of Copper-Based Perovskite Scintillators for High-Temperature X-ray Detection
Wang, Tian-Chi
Yao, Shu-Yi
Yan, Shuang-Peng
Yu, Jing
Deng, Zhi-Yong
Yakovlev, Alexey Nikolaevich
Meng, Bin
Qi, Jian-Bei
Xu, Xu-Hui
ACS APPLIED MATERIALS & INTERFACES, 2023, 15 (19) : 23421 - 23428
[42] The mechanical property and microstructural thermal stability of gradient-microstructured nanotwinned copper films electrodeposited on the highly (111)-orientated substrates
Zhang, Yu-Bo
Gao, Li-Yin
Tao, Jun-Lei
Wang, Yu-Xi
Liu, Zhi-Quan
Sun, Rong
MATERIALS TODAY COMMUNICATIONS, 2024, 38
[43] Solute synergy induced thermal stability of high-strength nanotwinned Al-Co-Zr alloys
Richter, N. A.
Zhang, Y. F.
Gong, M.
Niu, T.
Yang, B.
Xue, S.
Wang, J.
Wang, H.
Zhang, X.
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2023, 862
[44] Chemical mechanical planarization of nanotwinned copper/polyimide for low temperature hybrid bonding
He, Pin-Syuan
Tu, Chun-Wei
Shie, Kai-Cheng
Liu, Chien-Yu
Tsai, Hsin-Yu
Tran, Dinh-Phuc
Chen, Chih
JOURNAL OF ELECTROANALYTICAL CHEMISTRY, 2024, 969
[45] Thermal stability of grain structure for Ag nanotwinned films sputtered with substrate bias
Lai, Yu-Chang
Wu, Po-Ching
Chuang, Tung-Han
MATERIALIA, 2021, 20
[46] Synthesis of ZrAlN coatings with thermal stability at high temperature
LI Dejun College of Physics and Electronic Information Science
Science China Technological Sciences, 2006, (05) : 576 - 581
[47] Synthesis of ZrAlN coatings with thermal stability at high temperature
Li Dejun
SCIENCE IN CHINA SERIES E-TECHNOLOGICAL SCIENCES, 2006, 49 (05): : 576 - 581
[48] Thermal stability of graphene in inert atmosphere at high temperature
Liu, Fu
Wang, Mingjie
Chen, Yao
Gao, Jianmin
JOURNAL OF SOLID STATE CHEMISTRY, 2019, 276 : 100 - 103
[49] High temperature thermal stability investigation of paraffinic oil
Oyekunle, LO
Susu, AA
PETROLEUM SCIENCE AND TECHNOLOGY, 2005, 23 (02) : 199 - 207
[50] Synthesis of ZrAlN coatings with thermal stability at high temperature
Dejun Li
Science in China Series E: Technological Sciences, 2006, 49 : 576 - 581

← 1 2 3 4 5 →