Study of a single dangling bond at the SiO2/Si interface in deep submicron metal-oxide-semiconductor transistors

被引:13
|
作者
Militaru, L [1 ]
Souifi, A [1 ]
机构
[1] Inst Natl Sci Appl, CNRS, UMR 5511, Phys Mat Lab, F-69621 Villeurbanne, France
关键词
D O I
10.1063/1.1608493
中图分类号
O59 [应用物理学];
学科分类号
摘要
Two-level charge pumping (CP) measurements have been used for the study of a single trap situated at the SiO2/Si interface of sub-100 nm metal-oxide-semiconductor transistors (50 nm length). At room temperature, we have measured the emission time constant (tau) of the single trap and verified that the generation-recombination process was consistent with the Shockley-Read-Hall theory. Temperature-dependent CP measurements have been used to determine the thermal variation of the emission time constant. We show that an Arrhenius plot of the emission time constant versus the temperature (tauxT(2) vs 1/T) allows the determination of the capture cross section and energy position of the trap within the silicon band gap. The single trap, which has been characterized here, is shown to be the well-known donor P-b0 center (dangling bond) at the SiO2/Si (100) interface. (C) 2003 American Institute of Physics.
引用
收藏
页码:2456 / 2458
页数:3
相关论文
共 50 条
  • [41] INTERFACE STATES IN METAL-OXIDE-SEMICONDUCTOR FIELD-EFFECT TRANSISTORS
    SEQUIN, C
    BALDINGER, E
    SOLID-STATE ELECTRONICS, 1970, 13 (12) : 1527 - +
  • [42] Design of Si/SiGe heterojunction complementary metal-oxide-semiconductor transistors
    Sadek, A
    Ismail, K
    Armstrong, MA
    Antoniadis, DA
    Stern, F
    IEEE TRANSACTIONS ON ELECTRON DEVICES, 1996, 43 (08) : 1224 - 1232
  • [43] THE EFFECT OF FLUORINE IMPLANTATION ON THE INTERFACE RADIATION HARDNESS OF SI-GATE METAL-OXIDE-SEMICONDUCTOR TRANSISTORS
    NISHIOKA, Y
    OHYU, K
    OHJI, Y
    NATSUAKI, N
    MUKAI, K
    MA, TP
    JOURNAL OF APPLIED PHYSICS, 1989, 66 (08) : 3909 - 3912
  • [44] Digital oxide deposition of SiO2 layers for III-nitride metal-oxide-semiconductor heterostructure field-effect transistors
    Adivarahan, V
    Rai, S
    Tipirneni, N
    Koudymov, A
    Yang, J
    Simin, G
    Khan, MA
    APPLIED PHYSICS LETTERS, 2006, 88 (18)
  • [45] Characteristics of metal-oxide-semiconductor (MOS) device with Er metal gate on SiO2 film
    Choi, Chel-Jong
    Yang, Ha-Yong
    Hong, Hyo-Bong
    Kim, Jin-Gyu
    Chang, Sung-Yong
    Lee, Jouhahn
    MICROELECTRONICS RELIABILITY, 2009, 49 (04) : 463 - 465
  • [46] N-CHANNEL DEEP-DEPLETION METAL-OXIDE-SEMICONDUCTOR FIELD-EFFECT TRANSISTORS FABRICATED IN ZONE-MELTING-RECRYSTALLIZED POLYCRYSTALLINE SI FILMS ON SIO2
    TSAUR, BY
    GEIS, MW
    FAN, JCC
    SILVERSMITH, DJ
    MOUNTAIN, RW
    APPLIED PHYSICS LETTERS, 1981, 39 (11) : 909 - 911
  • [47] Hydrogen adsorption states at the Pd/SiO2 interface and simulation of the response of a Pd metal-oxide-semiconductor hydrogen sensor
    Eriksson, M
    Ekedahl, LG
    JOURNAL OF APPLIED PHYSICS, 1998, 83 (08) : 3947 - 3951
  • [48] Effects of stress annealing in nitrogen on the effective contact-potential difference, charges, and traps at the Si/SiO2 interface of metal-oxide-semiconductor devices
    Przewlocki, HM
    Massoud, HZ
    JOURNAL OF APPLIED PHYSICS, 2002, 92 (04) : 2198 - 2201
  • [49] Bias-temperature stability of the Cu(Mg)/SiO2/p-Si metal-oxide-semiconductor capacitors
    de Felipe, TS
    Murarka, SP
    Bedell, S
    Lanford, WA
    JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B, 1997, 15 (06): : 1987 - 1989
  • [50] FLICKER NOISE IN SUBMICRON METAL-OXIDE-SEMICONDUCTOR FIELD-EFFECT TRANSISTORS WITH NITRIDED GATE OXIDE
    TRIANTIS, DP
    BIRBAS, AN
    ZIMMERMANN, JJ
    JOURNAL OF APPLIED PHYSICS, 1995, 77 (11) : 6021 - 6025