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- [31] Measurement of the Strength of a Grain Boundary in Electroplated Copper Thin-film Interconnections by Using Micro Tensile-test 2016 IEEE 37TH INTERNATIONAL ELECTRONICS MANUFACTURING TECHNOLOGY (IEMT) & 18TH ELECTRONICS MATERIALS AND PACKAGING (EMAP) CONFERENCE, 2016,
- [33] The test study of micro copper cylinder upsetting PROCEEDINGS OF THE 1ST INTERNATIONAL CONFERENCE ON NEW FORMING TECHNOLOGY, 2004, : 165 - 170
- [34] Size effect on the high strain rate micro/meso-tensile behaviors of pure titanium foil JOURNAL OF MATERIALS RESEARCH AND TECHNOLOGY-JMR&T, 2021, 11 : 2146 - 2159
- [35] Development of Micro-Scale Tensile Fatigue Test System 2016 IEEE 11TH ANNUAL INTERNATIONAL CONFERENCE ON NANO/MICRO ENGINEERED AND MOLECULAR SYSTEMS (NEMS), 2016,
- [36] Research of size effects on tensile strength and elongation of copper foil Cailiao Kexue yu Gongyi/Material Science and Technology, 2010, 18 (04): : 445 - 449
- [37] Different response mechanisms of yield strength and ultimate tensile strength in pure copper considering size effect MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2022, 849
- [40] Size effect and geometrical effect of polycrystals and thin film/substrate system in micro-indentation test MODELING AND NUMERICAL SIMULATION OF MATERIALS BEHAVIOR AND EVOLUTION, 2002, 731 : 275 - 280