共 50 条
- [1] Application of atomic force probing on 90nm DRAM cell failure analysis [J]. IPFA 2006: PROCEEDINGS OF THE 13TH INTERNATIONAL SYMPOSIUM ON THE PHYSICAL & FAILURE ANALYSIS OF INTEGRATED CIRCUITS, 2006, : 340 - +
- [3] Successful development and implementation of statistical outlier techniques on 90nm and 65nm process driver devices [J]. 2006 IEEE INTERNATIONAL RELIABILITY PHYSICS SYMPOSIUM PROCEEDINGS - 44TH ANNUAL, 2006, : 552 - +
- [4] 90nm technology SRAM soft fail analysis using nanoprobing and junction stain TEM [J]. ISTFA 2006, 2006, : 512 - +
- [6] Silicon clean impact on 90nm CMOS devices performance [J]. ESSDERC 2003: PROCEEDINGS OF THE 33RD EUROPEAN SOLID-STATE DEVICE RESEARCH CONFERENCE, 2003, : 235 - 238
- [7] Analysis of data remanence in a 90nm FPGA [J]. PROCEEDINGS OF THE IEEE 2007 CUSTOM INTEGRATED CIRCUITS CONFERENCE, 2007, : 93 - 96
- [8] Leakage power analysis of a 90nm FPGA [J]. PROCEEDINGS OF THE IEEE 2003 CUSTOM INTEGRATED CIRCUITS CONFERENCE, 2003, : 57 - 60
- [9] Application of critical shape metrology to 90nm process [J]. Metrology, Inspection, and Process Control for Microlithography XIX, Pts 1-3, 2005, 5752 : 510 - 515
- [10] ` TEM application in the failure analysis of advanced 90 nm SOI-based IC devices [J]. IPFA 2006: PROCEEDINGS OF THE 13TH INTERNATIONAL SYMPOSIUM ON THE PHYSICAL & FAILURE ANALYSIS OF INTEGRATED CIRCUITS, 2006, : 205 - +