NEAR-FIELD SLIT PROBE INCORPORATING A MICROMACHINED SILICON CHIP FOR MILLIMETER-WAVE MICROSCOPY

被引：8
|
作者：
Nozokido, Tatsuo [1 ]
Miyasaka, Noriyuki [1 ]
Bae, Jongsuck [2 ]
机构：
[1] Toyama Univ, Grad Sch Sci & Engn Res, Toyama 9308555, Japan
[2] Nagoya Inst Technol, Dept Engn Phys Elect & Mech, Showa Ku, Nagoya, Aichi 4668555, Japan
来源：
MICROWAVE AND OPTICAL TECHNOLOGY LETTERS | 2011年 / 53卷 / 03期
基金：
日本学术振兴会;
关键词：
bulk micromachining; millimeter-wave imaging; near-field probes; scanning near-field microscopy;
D O I：
10.1002/mop.25793
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
A novel type of slit probe incorporating a micromachined silicon'(Si) chip for millimeter-wave scanning near-field microscopy is proposed. To improve the spatial resolution and image contrast attainable in millimeter-wave microscopy, a metal-coated Si chip with a microslit aperture fabricated using a bulk micromachining technique was attached to the tip of an ordinary slit-type probe at the end of a tapered rectangular waveguide. The design and fabrication of the Si chip are described, and the results from experiments performed at U-band (40-60 GHz) frequencies to demonstrate the feasibility of this new probe configuration are presented. (C) 2011 Wiley Periodicals, Inc. Microwave Opt Technol Lett 53:660-664, 2011; View this article online at wileyonlinelibrary.com. DOI 10.1002/mop.25793
引用
收藏
页码：660 / 664
页数：5
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