Modeling residual stresses in ceramic plates

被引:0
|
作者
Cantavella, V. [1 ]
Moreno, A. [1 ]
Mezquita, A. [1 ]
Reig, Y. [1 ]
机构
[1] Univ Jaume 1, Inst Tecnol Ceram, Castellon de La Plana 12006, Spain
关键词
residual stresses; heat transfer; firing; modeling; tiles;
D O I
暂无
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
The generation of residual stresses during cooling of layered ceramic plates has been modeled. Each plate comprises a body and two thin layers (engobe and glaze). The model takes into account two types of stresses: thermal stresses, resulting from temperature gradients inside the plate during cooling, and the stresses produced by the mismatch of the coefficient of thermal expansion (CTE) of the layers. The body has been simulated using a linear viscoelastic constitutive equation. The engobe and the glaze layer have been considered as elastic solids below a certain temperature (setting temperature: T-a). Above T-a these two layers have no mechanical influence on the body.
引用
收藏
页码:712 / 717
页数:6
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