Non-Destructive Testing for Defects in Electronic Package Based on Infrared Thermography

被引：0
|
作者：
Liu Chengyan [1 ]
Qin Fei [1 ]
Ban Zhaowei [1 ]
机构：
[1] Beijing Univ Technol, Coll Mech Engn & Appl Elect Technol, Beijing, Peoples R China
来源：
2013 14TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT) | 2013年
关键词：
electronic package; defect detection; infrared thermography; non-destructive testing; LOCK-IN THERMOGRAPHY; COMPOSITE STRUCTURES; FAILURE ANALYSIS; CIRCUITS; DEVICES;
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
Defects such as interfacial delaminations degrade the yield rate and reliability of the device. It's important to find and evaluate these defects on time. Infrared Thermography is proved to be a valuable tool for non-destructive testing of materials. In this paper the relationship between the thermal characteristics of the sample surface and the defect feature parameters is investigated using Infrared Thermography; while an approach to quantitatively evaluate the defect is proposed.
引用
收藏
页码：865 / 869
页数：5
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